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浏览/检索结果: 共240条，第1-10条 帮助 限定条件 专题：上海微系统与信息技术研究所    第一署名单位    第一作者单位    通讯作者单位     条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Transportation of carriers in silicon implanted SiO2 films during ionizing radiation 期刊论文  OAI收割 NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2012, 卷号: 272, 页码: 266-270 Chen, M; Zhang, ZX; Wei, X; Bi, DW; Zou, SC; Wang, X 收藏  |  浏览/下载：8/0  |  提交时间：2013/04/17 Silicon dioxide  Ion implantation  Total ionizing dose  Carrier transportation   Poly-Silicon Grating Couplers for Efficient Coupling With Optical Fibers 期刊论文  OAI收割 IEEE PHOTONICS TECHNOLOGY LETTERS, 2012, 卷号: 24, 期号: 18, 页码: 1614-1617 Qiu, C; Sheng, Z; Li, L; Pang, A; Wang, ZQ; Wu, AM; Wang, X; Zou, SC; Gan, FW 收藏  |  浏览/下载：13/0  |  提交时间：2013/04/17 Complementary metal-oxide-semiconductor (CMOS) technology  silicon-on-insulator (SOI) waveguide  silicon photonics  waveguide grating coupler   A Tunnel Diode Body Contact Structure for High-Performance SOI MOSFETs 期刊论文  OAI收割 IEEE TRANSACTIONS ON ELECTRON DEVICES, 2012, 卷号: 59, 期号: 1, 页码: 101-107 Luo, JX; Chen, J; Wu, QQ; Chai, Z; Zhou, JH; Yu, T; Dong, YJ; Li, L; Liu, W; Qiu, C; Wang, X 收藏  |  浏览/下载：13/0  |  提交时间：2013/04/17 Body contact  floating-body effects (FBEs)  kink effect  linear kink effect (LKE)  partially depleted (PD) silicon-on-insulator (SOI)  SOI MOSFETs  tunnel diode  tunnel diode body contact (TDBC)   Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding 期刊论文  OAI收割 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1484-1491 Wu, GQ; Xu, DH; Xiong, B; Wang, YC; Wang, YL; Ma, YL 收藏  |  浏览/下载：102/0  |  提交时间：2013/04/23 Bulk mode  glass frit bonding  microelectromechanical systems (MEMS)  redistribution  resonators  silicon bumps  vacuum package  wafer-level package   Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps 期刊论文  OAI收割 IEEE ELECTRON DEVICE LETTERS, 2012, 卷号: 33, 期号: 8, 页码: 1177-1179 Wu, GQ; Xu, DH; Xiong, B; Wang, YL 收藏  |  浏览/下载：17/0  |  提交时间：2013/04/23 Redistribution of electrical interconnection  silicon bumps  wafer-level packaging  3-D packaging   Thermocapillary Actuation of Droplets on a Microfluidic Chip 期刊论文  OAI收割 JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2012, 卷号: 26, 期号: 41625, 页码: 2165-2176 Gao, AR; Liu, X; Li, T; Gao, XL; Wang, YL 收藏  |  浏览/下载：75/0  |  提交时间：2013/04/23 Droplets  thermal gradient  silicon bulk process  contact angle hysteresis   Temperature Dependence of Hysteresis Effect in Partially Depleted Silicon-on-Insulator MOSFETs 期刊论文  OAI收割 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2012, 卷号: 12, 期号: 1, 页码: 63-67 Luo, JX; Chen, J; Zhou, JH; Wu, QQ; Chai, Z; Wang, X 收藏  |  浏览/下载：11/0  |  提交时间：2013/04/17 Hysteresis  MOSFET  partially depleted (PD) silicon-on-insulator (SOI)  SOI technology  temperature   Uncooled Thermoelectric Infrared Sensor With Advanced Micromachining 期刊论文  OAI收割 IEEE SENSORS JOURNAL, 2012, 卷号: 12, 期号: 6, 页码: - Xu, DH; Xiong, B; Wu, GQ; Ma, YL; Wang, YL 收藏  |  浏览/下载：14/0  |  提交时间：2013/04/23 Advanced micromachining  microelectromechanical systems (MEMS)  thermoelectric  uncooled infrared sensor  wet silicon etching  XeF2 silicon etching   Carrier Profiling of Individual Si Nanowires by Scanning Spreading Resistance Microscopy 期刊论文  OAI收割 NANO LETTERS, 2010, 卷号: 10, 期号: 1, 页码: 171-175 Ou, X; Das Kanungo, P; Kogler, R; Werner, P; Gosele, U; Skorupa, W; Wang, X 收藏  |  浏览/下载：15/0  |  提交时间：2012/03/24 SILICON NANOWIRES  PILE-UP  PHOSPHORUS  IMPURITIES  INTERFACE  TRANSPORT  GERMANIUM  DENSITY   Strain relaxation in nano-patterned strained-Si/SiGe heterostructure on insulator 期刊论文  OAI收割 APPLIED SURFACE SCIENCE, 2010, 卷号: 256, 期号: 11, 页码: 3499-3502 Liu, XY; Liu, WL; Ma, XB; Lv, SL; Song, ZT; Lin, CL 收藏  |  浏览/下载：10/0  |  提交时间：2012/03/24 SIGE-ON-INSULATOR  LAYERS  FABRICATION  OXIDATION  SILICON