Study on the manufacturing process of polymer microfluidic chip with integrated Cu micro array electrode
文献类型：会议论文
| 作者 | Gu, Yaoxin; Qiao HC(乔红超)
|
| 出版日期 | 2014 |
| 会议名称 | 2014 3rd International Conference on Applied Mechanics and Materials (ICAMM 2014) |
| 会议日期 | November 15-16, 2014 |
| 会议地点 | Shenzhen, China |
| 关键词 | Fracture Micro Array Electrode Microfluidic Chips Thermal Bonding |
| 页码 | 884-887 |
| 中文摘要 | To produce perfect polymer microfluidic chip with integrated metal micro array electrode, an oxygen-plasma assisted manufacturing process was developed. The Cu micro array electrodes on the poly substrate was formed by photolithography, sputtering and wet etching; the micro channels on the polymer plate were hot-embossed using metal master; the bonding of cover plate and substrate using thermal bonding. The surface of the polymer plate with micro channels was treated by oxygen-plasma before thermal bonding. The oxygen-plasma treatment could decrease thermal bonding temperature from 100 degC to 85 degC. The bonding of this chip is complete, the micro electrode array keeps its integrity, and the micro channel is not distorted obviously. |
| 产权排序 | 2 |
| 会议录 | Applied Mechanics and Materials
 |
| 会议录出版者 | Trans Tech Publications |
| 会议录出版地 | Zurich-Durnten, Switzerland |
| 语种 | 英语 |
| ISSN号 | 1660-9336 |
| ISBN号 | 978-3-03835-387-4 |
| 源URL | [http://ir.sia.ac.cn/handle/173321/17327]  |
| 专题 | 沈阳自动化研究所_装备制造技术研究室 |
| 推荐引用方式 GB/T 7714 | Gu, Yaoxin,Qiao HC. Study on the manufacturing process of polymer microfluidic chip with integrated Cu micro array electrode[C]. 见:2014 3rd International Conference on Applied Mechanics and Materials (ICAMM 2014). Shenzhen, China. November 15-16, 2014. |
入库方式： OAI收割
来源：沈阳自动化研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。