Interface sensing and cutting of ultra-thin film based on UV-assisted AFM
文献类型：会议论文
| 作者 | Shi JL(施佳林) ; Liu LQ(刘连庆)
|
| 出版日期 | 2015 |
| 会议名称 | 15th IEEE International Conference on Nanotechnology, IEEE-NANO 2015 |
| 会议日期 | July 27-30, 2015 |
| 会议地点 | Rome, Italy |
| 关键词 | atomic force microscopy ultrasonic vibration nanomchining ultra-thin film interface/material sensing |
| 页码 | 971-974 |
| 中文摘要 | Ultrasonic vibration (UV)-assisted method, as an innovative nanomachining technology, has competitive advantages compared to traditional atomic force microscopy (AFM) nanomachining methods. However, the UV-assisted machining process by AFM is still an open loop control method for cutting depth and sample mechanical properties. Furthermore, the real-time material/interface sensing is still absent when cutting on ultra-thin film. Detection method of machining object (thin film or substrate) remains an obstacle for AFM machining. Here we introduce an ultra-thin film interface sensing and cutting method based on UV-assisted AFM to realize the material/interface detection on the process of nano-machining. This new approach for sensing and cutting ultra-thin film is validated by our experimental results conducting on ultra-thin films with different thickness at nanoscale. |
| 收录类别 | EI ; CPCI（ISTP） |
| 产权排序 | 1 |
| 会议主办者 | Nanotechnology Council |
| 会议录 | IEEE-NANO 2015 - 15th International Conference on Nanotechnology
 |
| 会议录出版者 | IEEE |
| 会议录出版地 | Piscataway, NJ, USA |
| 语种 | 英语 |
| ISBN号 | 978-1-4673-8155-0 |
| WOS记录号 | WOS:000380515200160 |
| 源URL | [http://ir.sia.cn/handle/173321/18612]  |
| 专题 | 沈阳自动化研究所_机器人学研究室 |
| 推荐引用方式 GB/T 7714 | Shi JL,Liu LQ. Interface sensing and cutting of ultra-thin film based on UV-assisted AFM[C]. 见:15th IEEE International Conference on Nanotechnology, IEEE-NANO 2015. Rome, Italy. July 27-30, 2015. |
入库方式： OAI收割
来源：沈阳自动化研究所
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