Splitting of the neutral mechanical plane depends on the length of the multi-layer structure of flexible electronics
文献类型：期刊论文
| 作者 | Li S ; Su YW(苏业旺); Li R
|
| 刊名 | PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES
 |
| 出版日期 | 2016 |
| 卷号 | 472期号:2190页码:20160087 |
| 通讯作者邮箱 | yewangsu@imech.ac.cn ; ruili@dlut.edu.cn |
| 关键词 | neutral mechanical plane multi-layer structure flexible electronics structure design |
| ISSN号 | 1364-5021 |
| 产权排序 | [Li, Shuang; Su, Yewang] Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China; [Su, Yewang] Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA; [Su, Yewang] Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA; [Li, Rui] Dalian Univ Technol, Dept Engn Mech, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China |
| 通讯作者 | Su, YW (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China. ; Su, YW (reprint author), Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA. ; Su, YW (reprint author), Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA. ; Li, R (reprint author), Dalian Univ Technol, Dept Engn Mech, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China. |
| 中文摘要 | Multi-layer structures with soft (compliant) interlayers have been widely used in flexible electronics and photonics as an effective design for reducing interactions among the hard (stiff) layers and thus avoiding the premature failure of an entire device. The analytic model for bending of such a structure has not been well established due to its complex mechanical behaviour. Here, we present a rational analytic model, without any parameter fitting, to study the bending of a multilayer structure on a cylinder, which is often regarded as an important approach to mechanical reliability testing of flexible electronics and photonics. For the first time, our model quantitatively reveals that, as the key for accurate strain control, the splitting of the neutral mechanical plane depends not only on the relative thickness of the middle layer, but also on the length-to-thickness ratio of the multi-layer structure. The model accurately captures the key quantities, including the axial strains in the top and bottom layers, the shear strain in the middle layer and the locations of the neutral mechanical planes of the top and bottom layers. The effects of the length of the multi-layer and the thickness of the middle layer are elaborated. This work is very useful for the design of multi-layer structure-based flexible electronics and photonics. |
| 分类号 | 二类 |
| 类目[WOS] | Multidisciplinary Sciences |
| 研究领域[WOS] | Science & Technology - Other Topics |
| 关键词[WOS] | neutral mechanical plane ; multi-layer structure ; flexible electronics ; structure design |
| 收录类别 | SCI ; EI |
| 原文出处 | http://dx.doi.org/10.1098/rspa.2016.0087 |
| 语种 | 英语 |
| WOS记录号 | WOS:000379726800018 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/59572]  |
| 专题 | 力学研究所_非线性力学国家重点实验室 |
| 推荐引用方式 GB/T 7714 | Li S,Su YW,Li R. Splitting of the neutral mechanical plane depends on the length of the multi-layer structure of flexible electronics[J]. PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES,2016,472(2190):20160087. |
| APA | Li S,苏业旺,&Li R.(2016).Splitting of the neutral mechanical plane depends on the length of the multi-layer structure of flexible electronics.PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES,472(2190),20160087. |
| MLA | Li S,et al."Splitting of the neutral mechanical plane depends on the length of the multi-layer structure of flexible electronics".PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES 472.2190(2016):20160087. |
入库方式： OAI收割
来源：力学研究所
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