Wetting Behavior of Polymer Liquid in Insulation Process for Through Silicon Via
文献类型：会议论文
| 作者 | Zhao Songfang; Zhang Guoping; Sun Rong; Lee S. W. Ricky |
| 出版日期 | 2013 |
| 会议名称 | 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 |
| 会议地点 | Dalian, China |
| 英文摘要 | 3D packaging using through silicon via (TSV) technology is becoming important in the integrated circuit (IC) packaging industry. This paper reports the wetting behavior of polymer liquids in the insulation deposition process by spin coating. Two methods containing adding wetting agent into polymer liquid and coupling agent treatments to wafer surface were implemented to improve the wettability between the liquid and the wafer. From the viscosity tests, it was found that the wetting agent could improve the flowability and have little effect on the thixotropy of liquid. Besides, the surface tension of liquid was shifted to 31.14 mN/m from 32.16 mN/m with the addition of wetting agent. The coupling agent treatment to sidewall of vias (silicon) could increase the adhesion work value by at least 8 mN/m and avoid the sagging. Moreover, the wetting dynamics revealed that adding wetting agent to polymer liquid and coupling agent treatments to wafer could improve the wetting rate and decrease the balanced contact angle. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/4589]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2013 |
| 推荐引用方式 GB/T 7714 | Zhao Songfang,Zhang Guoping,Sun Rong,et al. Wetting Behavior of Polymer Liquid in Insulation Process for Through Silicon Via[C]. 见:2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013. Dalian, China. |
入库方式： OAI收割
来源：深圳先进技术研究院
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