中国科学院机构知识库网格系统: 检索

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	Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文 OAI收割 Harbin, China 作者: Qiang Liu; Guoping Zhang; Rong Sun; S. W. Ricky Lee; Ching-Ping Wong \| 收藏 \| 浏览/下载：14/0 \| 提交时间：2018/02/02
	NOVEL PERIODIC MESOPOROUS ORGANOSILICA THIN FILM WITH LOW DIELECTRIC CONSTANT AND HIGH MECHANICAL PROPERTY 会议论文 OAI收割 China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China 作者: Jiawei Zhang; Guoping Zhang; Rong Sun; S. W. Ricky Lee; C. P. Wong 收藏 \| 浏览/下载：15/0 \| 提交时间：2017/01/15
	Novel low-κ ADH-based periodic mesoporous organosilica thin film for interlayer dielectric 会议论文 OAI收割 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者: Jiawei Zhang; Guoping Zhang; Rong Sun; S. W. Ricky Lee; C. P. Wong 收藏 \| 浏览/下载：12/0 \| 提交时间：2017/01/15
	Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文 OAI收割 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者: Qiang Liu 收藏 \| 浏览/下载：20/0 \| 提交时间：2017/01/15
	Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文 OAI收割 IEEE Electronic Components and Technology Conference（ECTC）, 美国作者: Guoping Zhang; Kun Jiang; Qiang Liu; Jinhui Li; Rong Sun 收藏 \| 浏览/下载：15/0 \| 提交时间：2016/01/27
	Influence of rubber nanoparticles on the properties of Novolac-diazonaphthoquinone based photoresist 会议论文 OAI收割 The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China 作者: Qiang Liu; Guoping Zhang; Rong Sun; S. W. Ricky Lee; Chingping Wong 收藏 \| 浏览/下载：9/0 \| 提交时间：2016/01/27
	O2 plasma treatment in polymer insulation process for through silicon vias 会议论文 OAI收割 Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国作者: Zhuang, Lulu; Jiang, Kun; Zhang, Guoping; Tang, Jiaoning; Sun, Rong 收藏 \| 浏览/下载：17/0 \| 提交时间：2015/09/01
	Wetting Behavior of Polymer Liquid in Insulation Process for Through Silicon Via 会议论文 OAI收割 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China 作者: Zhao Songfang; Zhang Guoping; Sun Rong; Lee S. W. Ricky 收藏 \| 浏览/下载：12/0 \| 提交时间：2015/08/27
	Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via 会议论文 OAI收割 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, United states 作者: Zhao Songfang; Zhang Guoping; Peng Chongnan; Sun Rong; Lee S. W. Ricky 收藏 \| 浏览/下载：38/0 \| 提交时间：2015/08/27