中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Fabrication of CNT-based MEMS piezoresistive pressure sensors using DEP nanoassembly

文献类型:会议论文

作者Fung, Carmen K. M.; Zhang, Maggie Q. H.; Dong ZL(董再励); Li WJ(李文荣)
出版日期2005
会议名称2005 5th IEEE Conference on Nanotechnology
会议日期July 11, 2005 - July 15, 2005
会议地点Nagoya, Japan
页码369-372
通讯作者李文荣
中文摘要This paper reports the fabrication technique of a novel carbon nanotubes (CNTs) based MEMS pressure sensor with piezoresistive gauge factor potentially much greater than polysilicon based sensors. By using the dielectrophoretic (DEP) nanoassembly of CNTs and a MEMS-compatible process, we have successfully integrated bundled strands of CNT sensing elements on arrays of Polymethylmethacrylate (PMMA) diaphragms. The piezoresistive effects of CNT were preliminarily investigated by measuring the pressure-resistance dependency of the sensors and preliminary results indicated that the CNT-based micro sensors were capable of sensing input pressure variations. Moreover, the mechanical properties of the diaphragms were studied experimentally and theoretically, which showed the deflection and strain distribution of the diaphragms with different input pressures, in order to conclusively determine the piezoresistivity of bundled CNTs. Based on these experimental evidences, we propose that carbon nanotubes is a novel material for fabricating micro pressure sensors on polymer substrates - which may serve as alternative sensors for silicon based pressure sensors when bio-compatibility and low-cost applications are required.
收录类别EI
产权排序2
会议录2005 5th IEEE Conference on Nanotechnology
会议录出版者IEEE Computer Society
会议录出版地Piscataway, NJ, USA
语种英语
ISBN号978-0-7803-9199-4
源URL[http://ir.sia.cn/handle/173321/20016]  
专题沈阳自动化研究所_机器人学研究室
推荐引用方式
GB/T 7714
Fung, Carmen K. M.,Zhang, Maggie Q. H.,Dong ZL,et al. Fabrication of CNT-based MEMS piezoresistive pressure sensors using DEP nanoassembly[C]. 见:2005 5th IEEE Conference on Nanotechnology. Nagoya, Japan. July 11, 2005 - July 15, 2005.

入库方式: OAI收割

来源:沈阳自动化研究所

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