Configuration and adjustment of substrate preheating device
文献类型:会议论文
作者 | Zhang K(张凯); Long RS(龙日升); Liu WJ(刘伟军)![]() |
出版日期 | 2011 |
会议名称 | 2011 International Conference on Materials Engineering for Advanced Technologies, ICMEAT 2011 |
会议日期 | May 5-6, 2011 |
会议地点 | Singapore |
关键词 | Laser Metal Deposition Shaping (LMDS) Rapid prototyping Rapid manufacturing Substrate Preheating Device Configuration and Adjustment |
页码 | 1516-1520 |
通讯作者 | 张凯 |
中文摘要 | Laser Metal Deposition Shaping (LMDS) is a state-of-the-art technology that combines rapid prototyping and laser processing. There are many factors affecting the quality, precision, microstructure and performance of LMDS-deposited parts. Among them, substrate preheating is a significant one since it can change the heat history of the LMDS process. Preheating is often used to reduce the residual stresses and the risk of thermal distortion and cracking. In this work a set of substrate preheating device for LMDS system employed with dual-channel control, namely intelligent PID temperature control and realtime serial-port temperature acquisition and feedback control, is designed and developed. In addition, the heating up rule gained through the relative experiment is introduced to reduce the overshoot amplitude of substrate preheating device by cascade control method. The results show that not only can this substrate preheating device realize the dual-channel control and continuous adjustment of substrate preheating temperature, but also can realtime collect and record the substrate temperature. |
收录类别 | EI ; CPCI(ISTP) |
产权排序 | 3 |
会议主办者 | National University of Singapore; Asia Pacific Human-Computer Interaction Research Center |
会议录 | Key Engineering Materials
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会议录出版者 | Trans Tech Publication |
会议录出版地 | Zurich-Durnten, Switzerland |
语种 | 英语 |
ISSN号 | 1013-9826 |
ISBN号 | 978-3-03785-131-9 |
WOS记录号 | WOS:000309483200284 |
源URL | [http://ir.sia.cn/handle/173321/19973] ![]() |
专题 | 沈阳自动化研究所_装备制造技术研究室 |
推荐引用方式 GB/T 7714 | Zhang K,Long RS,Liu WJ. Configuration and adjustment of substrate preheating device[C]. 见:2011 International Conference on Materials Engineering for Advanced Technologies, ICMEAT 2011. Singapore. May 5-6, 2011. |
入库方式: OAI收割
来源:沈阳自动化研究所
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