中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Effect of laser peening on residual stress and micro-hardness of TC4 titanium alloy

文献类型:会议论文

作者Qiao HC(乔红超); Zhao JB(赵吉宾); Zhao, Yixiang; Li L(李论)
出版日期2013
会议名称2013 2nd International Conference On Systems Engineering and Modeling (ICSEM-13)
会议日期April 19-20, 2013
会议地点Beijing, China
关键词laser peening micro-hardness residual stress titanium alloy surface treatment
页码439-443
中文摘要Laser peening offers potential advantages over conventional peen technologies in terms of the depth of the residual stresses that can be induced, and improvements in surface micro-hardness. The present study was undertaken to understand the effect of laser penning on the properties of titanium alloy, a TC4 titanium alloy work-piece was processed with ND: YAG laser with the wavelength of 1064 nm, pulse energy of 0-10J and pulse width of 12ns, and micro-hardness and residual stress for different laser peening parameters were examined and analyzed by micro-hardness tester and X-ray diffraction. Results are presented and discussed of the residual stress profiles and the micro-hardness profiles, The experimental results show that the satisfying laser peening appearance can be achieved when the pulse energy was 6J, water tamping layer thickness was 1.8mm and ablative layer thickness was 100μm, surface micro-hardness increased by up to 33% and the compressive residual stress on the surface of laser shocked area reached up to -327.8MPa, laser peening improved hardness and residual stress of titanium alloy significantly. The experiment results show that the effect of laser peening was evidently.
产权排序1
会议录Proceedings of the 2nd International Conference On Systems Engineering and Modeling (ICSEM-13)
会议录出版者Atlantis Press
会议录出版地Paris, France
语种英语
ISBN号978-94-91216-42-8
源URL[http://ir.sia.cn/handle/173321/19976]  
专题沈阳自动化研究所_装备制造技术研究室
推荐引用方式
GB/T 7714
Qiao HC,Zhao JB,Zhao, Yixiang,et al. Effect of laser peening on residual stress and micro-hardness of TC4 titanium alloy[C]. 见:2013 2nd International Conference On Systems Engineering and Modeling (ICSEM-13). Beijing, China. April 19-20, 2013.

入库方式: OAI收割

来源:沈阳自动化研究所

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