中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
3D environment modeling with height dimension reduction and path planning for UAV

文献类型:会议论文

作者Yang LY(杨丽英)2; Lv Z(吕哲)1,2; Han ZH(韩忠华)1,2; Liu Z(刘重)2; He YQ(何玉庆)2; Zhu F(朱枫); Hao YM(郝颖明); Fu SF(付双飞); Fan XP(范晓鹏); Wei JY(魏景阳)
出版日期2017
会议名称9th International Conference on Modelling, Identification and Control, ICMIC 2017
会议日期July 10-12, 2017
会议地点Kunming, China
关键词Environment modeling Path planning Grid method A* algorithm
页码734-739
通讯作者Lv Z(吕哲)
中文摘要In this paper, an environment modeling method with height dimension reduction for unmanned aerial vehicle (UAV) path planning is presented. Based on the traditional grid method, a plane being vertical to yz-plane and including the start point and end point is considered in this method. Comparing the height of this plane and obstacles, the environment model could be set up through re-dividing the plane by grid method. Above idea reduces the dimension of the 3D environment model and ignores the obstacles which are lower than the flying height of UAV. In this way, the accuracy of the proposed environment model method could be increased, and the efficiency of the path planning algorithm could be ensured further. Simulation experiment shows the effectiveness of this environment modeling method by applying A algorithm for path planning.
收录类别EI
产权排序1
会议录Proceedings of 2017 9th International Conference On Modelling, Identification and Control, ICMIC 2017
会议录出版者IEEE
会议录出版地New York
语种英语
ISBN号978-1-5090-6573-8
源URL[http://ir.sia.cn/handle/173321/22413]  
专题沈阳自动化研究所_光电信息技术研究室
通讯作者Hao YM(郝颖明)
作者单位1.Faculty of Information and Control Engineering, Shenyang Jianzhu University, Shenyang 110168, China
2.State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang 110016, China
推荐引用方式
GB/T 7714
Yang LY,Lv Z,Han ZH,et al. 3D environment modeling with height dimension reduction and path planning for UAV[C]. 见:9th International Conference on Modelling, Identification and Control, ICMIC 2017. Kunming, China. July 10-12, 2017.

入库方式: OAI收割

来源:沈阳自动化研究所

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