Effective Validation of the Semi-physical Test Bench for Sun Orientation
文献类型:会议论文
作者 | Zhang X(张啸)![]() ![]() ![]() |
出版日期 | 2017 |
会议名称 | 7th Annual IEEE International Conference on Cyber Technology in Automation, Control, and Intelligent Systems (IEEE-CYBER 2017) |
会议日期 | July 31 - August 4, 2017 |
会议地点 | Hawaii, USA |
关键词 | Effective Validation the Semi-physical Test Bench Sun Orientation |
页码 | 1-6 |
通讯作者 | He Y(贺云) |
中文摘要 | In this paper, a new method is presented to test the loading effectiveness of the semi-physical test system based on the torsional vibration system, which is on behalf of the ground test equipment driven by solar panels. The dynamic model of the torsional vibration system is established, and the rationality of the scheme is verified through simulation analysis; by comparing the loading torque curve of the dynamic model with the curve generated by the physical object, the effectiveness of the semi-physical test bench is validated. The experimental result shows the semi-physical test bench has high loading precision and meets the requirements of experiments. By evaluation on the equivalent dynamic model with known characteristics, the characteristics of the test bench become clear, so this method has a certain reference value for performance test of other semi-physical test equipment. |
产权排序 | 1 |
会议录 | 7th Annual IEEE International Conference on Cyber Technology in Automation, Control, and Intelligent Systems (IEEE-CYBER 2017)
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会议录出版者 | IEEE |
会议录出版地 | New York |
语种 | 英语 |
ISBN号 | 978-1-5386-0489-2 |
源URL | [http://ir.sia.cn/handle/173321/21286] ![]() |
专题 | 沈阳自动化研究所_装备制造技术研究室 |
作者单位 | 1.State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China 2.University of Chinese Academy of Sciences, Beijing, China |
推荐引用方式 GB/T 7714 | Zhang X,Xu ZG,He Y,et al. Effective Validation of the Semi-physical Test Bench for Sun Orientation[C]. 见:7th Annual IEEE International Conference on Cyber Technology in Automation, Control, and Intelligent Systems (IEEE-CYBER 2017). Hawaii, USA. July 31 - August 4, 2017. |
入库方式: OAI收割
来源:沈阳自动化研究所
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