Formation of nanostructured copper filaments in electrochemical deposition
文献类型：期刊论文
| 作者 | Zhong, S; Wang, Y; Wang, M; Zhang, MZ; Yin, XB; Peng, RW; Ming, NB |
| 刊名 | Physical review e
 |
| 出版日期 | 2003-06-01 |
| 卷号 | 67期号:6页码:9 |
| ISSN号 | 1539-3755 |
| DOI | 10.1103/physreve.67.061601 |
| 通讯作者 | Zhong, s() |
| 英文摘要 | In this paper, we report in detail the studies of a different self-organized copper electrodeposition carried out in an ultrathin layer of cuso(4) electrolyte. on a macroscopic scale, the morphology of the electrodeposit is fingerlike. microscopically, each fingering branch consists of long, straight copper filaments with periodic corrugated nanostructures. branching rate of the electrodeposit is significantly decreased, compared with the patterns grown in conventional systems. detailed information of the growth environment in the ultrathin electrodeposition system is provided, the formation mechanism of the periodic nanostructures on the deposit filaments is explored, and the origin of the significant descent of branching rate of the electrodeposit is discussed. |
| WOS关键词 | THIN-LAYER ELECTRODEPOSITION ; DIFFUSION-LIMITED AGGREGATION ; MORPHOLOGICAL TRANSITIONS ; FINGERING INSTABILITY ; HECKER TRANSITION ; GROWTH ; ELECTROCONVECTION ; CONNECTIONS ; CONVECTION ; SELECTION |
| WOS研究方向 | Physics |
| WOS类目 | Physics, Fluids & Plasmas ; Physics, Mathematical |
| 语种 | 英语 |
| WOS记录号 | WOS:000184081000049 |
| 出版者 | AMER PHYSICAL SOC |
| URI标识 | http://www.irgrid.ac.cn/handle/1471x/2373966 |
| 专题 | 物理研究所 |
| 通讯作者 | Zhong, S |
| 作者单位 | 1.Nanjing Univ, Natl Lab Solid State Microstruct, Nanjing 210093, Peoples R China 2.Nanjing Univ, Dept Phys, Nanjing 210093, Peoples R China 3.Chinese Acad Sci, Int Ctr Quantum Struct, Beijing 100080, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhong, S,Wang, Y,Wang, M,et al. Formation of nanostructured copper filaments in electrochemical deposition[J]. Physical review e,2003,67(6):9. |
| APA | Zhong, S.,Wang, Y.,Wang, M.,Zhang, MZ.,Yin, XB.,...&Ming, NB.(2003).Formation of nanostructured copper filaments in electrochemical deposition.Physical review e,67(6),9. |
| MLA | Zhong, S,et al."Formation of nanostructured copper filaments in electrochemical deposition".Physical review e 67.6(2003):9. |
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