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Chinese Academy of Sciences Institutional Repositories Grid
Optimal teleportation via thermal entangled states of a two-qubit heisenberg chain

文献类型:期刊论文

作者Zhou, Yue1; Zhang, Guo-Feng2; Li, Shu-Shen1; Abliz, Ahmad3
刊名Epl
出版日期2009-06-01
卷号86期号:5页码:6
ISSN号0295-5075
DOI10.1209/0295-5075/86/50004
通讯作者Zhou, yue()
英文摘要We study the optimal teleportation based on bell measurements via the thermal states of a two-qubit heisenberg xxx chain in the presence of the dzyaloshinsky-moriya (dm) anisotropic antisymmetric interaction and obtain an optimal unitary transformation. the explicit expressions of the output state and the teleportation fidelity are presented and compared with those of the standard protocol. it is shown that in this protocol the teleportation fidelity is always larger and the unit fidelity is achieved at zero temperature. the dm interaction can enhance the teleportation fidelity at finite temperatures, as opposed to the effect of the interaction in the standard protocol. cases with other types of anisotropies are also discussed. copyright (c) epla, 2009
WOS关键词PROBABILISTIC TELEPORTATION ; QUANTUM TELEPORTATION ; MAGNETIC-FIELD ; ANISOTROPY
WOS研究方向Physics
WOS类目Physics, Multidisciplinary
语种英语
WOS记录号WOS:000269357500005
出版者EDP SCIENCES S A
URI标识http://www.irgrid.ac.cn/handle/1471x/2427646
专题半导体研究所
通讯作者Zhou, Yue
作者单位1.Chinese Acad Sci, Inst Semicond, State Key Lab Superlattices & Microstruct, Beijing 100083, Peoples R China
2.Beijing Univ Aeronaut & Astronaut, Sch Phys, Beijing 100083, Peoples R China
3.Xinjiang Normal Univ, Sch Math Phys & Informat, Urumqi 830045, Peoples R China
推荐引用方式
GB/T 7714
Zhou, Yue,Zhang, Guo-Feng,Li, Shu-Shen,et al. Optimal teleportation via thermal entangled states of a two-qubit heisenberg chain[J]. Epl,2009,86(5):6.
APA Zhou, Yue,Zhang, Guo-Feng,Li, Shu-Shen,&Abliz, Ahmad.(2009).Optimal teleportation via thermal entangled states of a two-qubit heisenberg chain.Epl,86(5),6.
MLA Zhou, Yue,et al."Optimal teleportation via thermal entangled states of a two-qubit heisenberg chain".Epl 86.5(2009):6.

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来源:半导体研究所

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