Pressure-Free Phenomenon in Top Layer of Chip Body Under Local Pressure and Design of Channel-Free Flat-Packaged IGBT
文献类型：期刊论文
| 作者 | Yu QQ(喻巧群); Teng Y(腾渊); Zhu YJ(朱阳军); Zhang WL(张文亮) |
| 刊名 | IEEE Electron Device Letters
 |
| 出版日期 | 2014-06-19 |
| 公开日期 | 2015-05-06 |
| 源URL | [http://10.10.10.126/handle/311049/12772]  |
| 专题 | 微电子研究所_硅器件与集成研发中心 |
| 通讯作者 | Zhu YJ(朱阳军) |
| 推荐引用方式 GB/T 7714 | Yu QQ,Teng Y,Zhu YJ,et al. Pressure-Free Phenomenon in Top Layer of Chip Body Under Local Pressure and Design of Channel-Free Flat-Packaged IGBT[J]. IEEE Electron Device Letters,2014. |
| APA | 喻巧群,腾渊,朱阳军,&张文亮.(2014).Pressure-Free Phenomenon in Top Layer of Chip Body Under Local Pressure and Design of Channel-Free Flat-Packaged IGBT.IEEE Electron Device Letters. |
| MLA | 喻巧群,et al."Pressure-Free Phenomenon in Top Layer of Chip Body Under Local Pressure and Design of Channel-Free Flat-Packaged IGBT".IEEE Electron Device Letters (2014). |
入库方式： OAI收割
来源：微电子研究所
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