中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique

文献类型:期刊论文

作者Zhou, XF ; Che, LF ; Xiong, B ; Fan, KB ; Wang, YL ; Wang, ZK
刊名JOURNAL OF MICROMECHANICS AND MICROENGINEERING
出版日期2010
卷号20期号:11页码:115009-115009
关键词ALKALINE-SOLUTIONS SILICON KOH TMAH SI(100) SURFACE
ISSN号0960-1317
通讯作者Che, LF, Chinese Acad Sci, Sci & Technol Microsyst Lab, State Key Lab Transducer Technol, Shanghai Inst Microsyst & Informat Technol, 865 Changning Rd, Shanghai 200050, Peoples R China
学科主题Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Instruments & Instrumentation; Materials Science, Multidisciplinary; Mechanics
收录类别SCI
语种英语
公开日期2011-12-17
源URL[http://ir.sim.ac.cn/handle/331004/38373]  
专题上海微系统与信息技术研究所_微系统技术_期刊论文
推荐引用方式
GB/T 7714
Zhou, XF,Che, LF,Xiong, B,et al. Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2010,20(11):115009-115009.
APA Zhou, XF,Che, LF,Xiong, B,Fan, KB,Wang, YL,&Wang, ZK.(2010).Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,20(11),115009-115009.
MLA Zhou, XF,et al."Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 20.11(2010):115009-115009.

入库方式: OAI收割

来源:上海微系统与信息技术研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。