Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique
文献类型:期刊论文
作者 | Zhou, XF ; Che, LF ; Xiong, B ; Fan, KB ; Wang, YL ; Wang, ZK |
刊名 | JOURNAL OF MICROMECHANICS AND MICROENGINEERING
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出版日期 | 2010 |
卷号 | 20期号:11页码:115009-115009 |
关键词 | ALKALINE-SOLUTIONS SILICON KOH TMAH SI(100) SURFACE |
ISSN号 | 0960-1317 |
通讯作者 | Che, LF, Chinese Acad Sci, Sci & Technol Microsyst Lab, State Key Lab Transducer Technol, Shanghai Inst Microsyst & Informat Technol, 865 Changning Rd, Shanghai 200050, Peoples R China |
学科主题 | Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Instruments & Instrumentation; Materials Science, Multidisciplinary; Mechanics |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2011-12-17 |
源URL | [http://ir.sim.ac.cn/handle/331004/38373] ![]() |
专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
推荐引用方式 GB/T 7714 | Zhou, XF,Che, LF,Xiong, B,et al. Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2010,20(11):115009-115009. |
APA | Zhou, XF,Che, LF,Xiong, B,Fan, KB,Wang, YL,&Wang, ZK.(2010).Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,20(11),115009-115009. |
MLA | Zhou, XF,et al."Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 20.11(2010):115009-115009. |
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