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浏览/检索结果: 共521条，第1-10条 帮助 限定条件 专题：微系统技术    第一署名单位    第一作者单位    通讯作者单位     条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序作者升序作者降序 Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding 期刊论文  OAI收割 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1484-1491 Wu, GQ; Xu, DH; Xiong, B; Wang, YC; Wang, YL; Ma, YL 收藏  |  浏览/下载：115/0  |  提交时间：2013/04/23 Bulk mode  glass frit bonding  microelectromechanical systems (MEMS)  redistribution  resonators  silicon bumps  vacuum package  wafer-level package   Micro-/Nanocombined Gas Sensors With Functionalized Mesoporous Thin Film Self-Assembled in Batches Onto Resonant Cantilevers 期刊论文  OAI收割 IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2012, 卷号: 59, 期号: 12, 页码: 4881-4887 Yu, HT; Xu, PC; Xia, XY; Lee, DW; Li, XX 收藏  |  浏览/下载：29/0  |  提交时间：2013/04/23 Chemical sensor  in-wall modification  mesoporous thin film (MTF)  microelectromechanical systems (MEMS)  resonant cantilever   Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiP 期刊论文  OAI收割 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2012, 卷号: 18, 期号: 1, 页码: 119-126 Tang, JJ; Ding, XY; Geng, F; Sun, XW; Luo, L 收藏  |  浏览/下载：24/0  |  提交时间：2013/04/23 Charge Transport within a Three-Dimensional DNA Nanostructure Framework 期刊论文  OAI收割 JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2012, 卷号: 134, 期号: 32, 页码: 13148-13151 Lu, N; Pei, H; Ge, ZL; Simmons, CR; Yan, H; Fan, CH 收藏  |  浏览/下载：39/0  |  提交时间：2013/04/23 CMOS MEMS-based thermoelectric generator with an efficient heat dissipation path 期刊论文  OAI收割 JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2012, 卷号: 22, 期号: 10, 页码: 105011 Yu, X; Wang, YC; Liu, YX; Li, T; Zhou, H; Gao, XL; Feng, F; Roinila, T; Wang, YL 收藏  |  浏览/下载：31/0  |  提交时间：2013/04/23 Highly Sensitive and Selective Chip-Based Fluorescent Sensor for Mercuric Ion: Development and Comparison of Turn-On and Turn-Off Systems 期刊论文  OAI收割 ANALYTICAL CHEMISTRY, 2012, 卷号: 84, 期号: 18, 页码: 8060-8066 Du, J; Liu, MY; Lou, XH; Zhao, T; Wang, Z; Xue, Y; Zhao, JL; Xu, YS 收藏  |  浏览/下载：42/0  |  提交时间：2013/04/23 Weak localization in few-layer graphene grown on copper foils by chemical vapor deposition 期刊论文  OAI收割 CARBON, 2012, 卷号: 50, 期号: 14, 页码: 5242-5246 Wang, WR; Chen, L; Wang, Z; Wang, YC; Li, T; Wang, YL 收藏  |  浏览/下载：25/0  |  提交时间：2013/04/23 Enhanced Sensing of Nucleic Acids with Silicon Nanowire Field Effect Transistor Biosensors 期刊论文  OAI收割 NANO LETTERS, 2012, 卷号: 12, 期号: 10, 页码: 5262-5268 Gao, AR; Lu, N; Wang, YC; Dai, PF; Li, T; Gao, XL; Wang, YL; Fan, CH 收藏  |  浏览/下载：53/0  |  提交时间：2013/04/23 SiNW-FETs  biosensor  ultrasensitive  detection limit   A high Q micromachined single crystal silicon bulk mode resonator with pre-etched cavity 期刊论文  OAI收割 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2012, 卷号: 18, 期号: 1, 页码: 25-30 Wu, GQ; Xu, DH; Xiong, B; Wang, YL 收藏  |  浏览/下载：34/0  |  提交时间：2013/04/23 Preparation of Sn-Ag-In Solder Bumps by Electroplating of Sn-Ag and Indium in Sequence and the Effect of Indium Addition on Microstructure and Shear Strength 期刊论文  OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 卷号: 2, 期号: 8, 页码: 1275-1279 Wang, DL; Yuan, Y; Luo, L 收藏  |  浏览/下载：24/0  |  提交时间：2013/04/23 Indium additive influence  microstructural change  shear strength  Sn-Ag-In solder bumps