Warpage and Reliability of a 3D-MCM on an Embedded Substrate With Multiple Interconnection Method
文献类型：期刊论文
| 作者 | Xu, GW ; Geng, F ; Huang, QP ; Luo, L ; Zhou, JA |
| 刊名 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
 |
| 出版日期 | 2010 |
| 卷号 | 33期号:3页码:571-581 |
| 关键词 | SOLDER JOINT RELIABILITY ASSEMBLIES |
| ISSN号 | 1521-3331 |
| 通讯作者 | Xu, GW, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 201203, Peoples R China |
| 学科主题 | Engineering, Manufacturing; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2011-12-17 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/38377]  |
| 专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Xu, GW,Geng, F,Huang, QP,et al. Warpage and Reliability of a 3D-MCM on an Embedded Substrate With Multiple Interconnection Method[J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,2010,33(3):571-581. |
| APA | Xu, GW,Geng, F,Huang, QP,Luo, L,&Zhou, JA.(2010).Warpage and Reliability of a 3D-MCM on an Embedded Substrate With Multiple Interconnection Method.IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,33(3),571-581. |
| MLA | Xu, GW,et al."Warpage and Reliability of a 3D-MCM on an Embedded Substrate With Multiple Interconnection Method".IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 33.3(2010):571-581. |
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