Suspended Photoresist Thin Film for Fabrication of Through Silicon Vias
文献类型：期刊论文
| 作者 | Wu,ZY ; Yang,H ; Dou,CG ; Wu,YH ; Li,XX ; Wang,YL |
| 刊名 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
 |
| 出版日期 | 2011 |
| 卷号 | 1期号:9页码:1345-1349 |
| 关键词 | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| ISSN号 | 2156-3950 |
| 学科主题 | Engineering ; Manufacturing; Engineering ; Electrical & Electronic; Materials Science ; Multidisciplinary |
| 公开日期 | 2012-04-12 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/106936]  |
| 专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wu,ZY,Yang,H,Dou,CG,et al. Suspended Photoresist Thin Film for Fabrication of Through Silicon Vias[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2011,1(9):1345-1349. |
| APA | Wu,ZY,Yang,H,Dou,CG,Wu,YH,Li,XX,&Wang,YL.(2011).Suspended Photoresist Thin Film for Fabrication of Through Silicon Vias.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,1(9),1345-1349. |
| MLA | Wu,ZY,et al."Suspended Photoresist Thin Film for Fabrication of Through Silicon Vias".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 1.9(2011):1345-1349. |
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