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Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors
文献类型：期刊论文
| 作者 | Fung, C.K.M.; Wong, V.T.S.; Chan, R.H.M.; Li WJ(李文荣)
|
| 刊名 | IEEE Transactions on Nanotechnology
 |
| 出版日期 | 2004 |
| 卷号 | 3期号:3页码:395- 403 |
| 关键词 | AC electrophoretic manipulation carbon nanotube (CNT) CNT sensors nano batch fabrication nanomanufacturing |
| ISSN号 | 1536-125X |
| 产权排序 | 3 |
| 通讯作者 | Fung, C.K.M. |
| 中文摘要 | We present a feasible technology for batch assembly of carbon nanotube (CNT) devices by utilizing ac electrophoretic technique to manipulate multiwalled bundles on an Si/SiO2 substrate. Based on this technique, CNTs were successfully and repeatably manipulated between microfabricated electrodes. By using this parallel assembly process, we have investigated the possibility of batch fabricating functional CNT devices when an ac electrical field is applied to an array of microelectrodes that are electrically connected together. Preliminary experimental results showed that over 70% of CNT functional devices can be assembled successfully using our technique, which is considered to be a good yield for nanodevices manufacturing. Besides, the devices were demonstrated to potentially serve as novel thermal sensors with low power consumption (∼microwatts) with electronic circuit response of approximately 100 kHz in constant current mode operation. In this paper, we will present the fabrication process of this feasible batch manufacturable method for functional CNT-based thermal sensors, which will dramatically reduce production costs and production time of nanosensing devices and potentially enable fully automated assembly of CNT-based devices. Experimental results from the thermal sensors fabricated by this batch process will also be discussed. |
| WOS标题词 | Science & Technology ; Technology ; Physical Sciences |
| 类目[WOS] | Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied |
| 研究领域[WOS] | Engineering ; Science & Technology - Other Topics ; Materials Science ; Physics |
| 关键词[WOS] | SHEAR-STRESS SENSOR ; ELECTRICAL-CONDUCTIVITY ; AC ELECTROPHORESIS ; CONTACT RESISTANCE ; OHMIC CONTACTS ; PURIFICATION ; ORIENTATION ; PLACEMENT ; ARRAYS ; METAL |
| 收录类别 | SCI ; EI ; CPCI（ISTP） |
| 语种 | 英语 |
| WOS记录号 | WOS:000223725000010 |
| 公开日期 | 2012-05-29 |
| 源URL | [http://ir.sia.cn/handle/173321/7345]  |
| 专题 | 沈阳自动化研究所_机器人学研究室 |
| 推荐引用方式 GB/T 7714 | Fung, C.K.M.,Wong, V.T.S.,Chan, R.H.M.,et al. Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors[J]. IEEE Transactions on Nanotechnology,2004,3(3):395- 403. |
| APA | Fung, C.K.M.,Wong, V.T.S.,Chan, R.H.M.,&Li WJ.(2004).Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors.IEEE Transactions on Nanotechnology,3(3),395- 403. |
| MLA | Fung, C.K.M.,et al."Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors".IEEE Transactions on Nanotechnology 3.3(2004):395- 403. |
入库方式： OAI收割
来源：沈阳自动化研究所
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