中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Fabrication of gold nano-particle based sensors using microspotting and DEP technologies

文献类型:会议论文

作者Siu Ling Leung; Li ML(李明林); Fong Ting Lau; Li WJ(李文荣)
出版日期2008
会议名称Annual Conference of the SICE
会议日期August 20-22, 2008
会议地点Chofu, JAPAN
关键词AC electrokinetics Dielectrophoresis Force Gold Collodial Particles Micro-spotting
页码3031-3036
中文摘要We have shown that Au nanoparticles (Au NPs) pearl chain could be formed consistently between microelectrodes by combining microspotting and DEP technologies. Experimental results on varying the Au particle size and dielectrophoretic (DEP) parameters, including voltage and frequency, are reported in this paper to explore the critical parameters in controlling the Pearl Chain Formation (PCF) process between microelectrodes. PCF was observed from 10 kHz to 5 MHz for 100 nm Au NPs, and 100 kHz to 10 MHz for 10 nm Au NPs. Variations in formation rate were detected when the applied voltage and particle size varied. With higher voltage, pearl chain began to form at higher rate and the formation time decreased. The optimum frequency of the Au NPs PCF shifted to higher frequency region when the particle size decreased. Theoretical analysis was carried out by applying the theories of DEP force and AC electrokinetics to explain the observations with the DEP frequency ranging from 10 Hz to 10 MHz. Finally, Au nanoparticle chains formed between the microelectrodes were shown to vary in resistance when environmental temperature was changed, indicating that these Au particle sensors could potentially be used to sense temperature and other thermal-based physical phenomena.
收录类别EI ; CPCI(ISTP)
产权排序2
会议录2008 PROCEEDINGS OF SICE ANNUAL CONFERENCE, VOLS 1-7
会议录出版者IEEE
会议录出版地NEW YORK
语种英语
ISBN号978-4-907764-30-2
WOS记录号WOS:000263966702096
源URL[http://ir.sia.cn/handle/173321/8705]  
专题沈阳自动化研究所_机器人学研究室
推荐引用方式
GB/T 7714
Siu Ling Leung,Li ML,Fong Ting Lau,et al. Fabrication of gold nano-particle based sensors using microspotting and DEP technologies[C]. 见:Annual Conference of the SICE. Chofu, JAPAN. August 20-22, 2008.

入库方式: OAI收割

来源:沈阳自动化研究所

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