Nanoscale welding of MWCNTs for nanodevice applications
文献类型:会议论文
作者 | Yu HB(于海波); Dong ZL(董再励); Li WJ(李文荣) |
出版日期 | 2010 |
会议名称 | 2010 4th IEEE Nanotechnology Materials and Devices Conference, NMDC2010 |
会议日期 | October 12-15, 2010 |
会议地点 | Monterey, CA, USA |
页码 | 216-220 |
中文摘要 | This paper describes a process to perform nanoscale welding of multi-walled carbon nanotubes (MWCNTs) using a conductive atomic force microscopy (AFM) tip. An AFM tip can be used not only to apply a mechanical force to push, drag or scratch a sample, but also to exert an electrostatic force between the conductive tip and a sample substrate by applying a bias voltage. This electrostatic field will be extremely high, due to the phenomenon of local field enhancement. Such a high electric field will provide enough energy for the metal atoms to evaporate from the conductive tip. In this paper, a model is developed to simulate the electrostatic field by adjusting the distance and the bias voltage between the conductive tip and substrate. The simulation results show that the radius of the conductive tip, the bias voltage and the gap distance will all affect the electric field intensity. In our experiments, MWCNTs are first assembled between a pair of electrodes using a dielectrophoresis (DEP) technique. Then, an electrostatic field is applied to weld MWCNTs onto the surface of microelectrodes. The experimental results show that MWCNTs can effectively be welded and the electronics performance can also be greatly improved. |
收录类别 | EI |
产权排序 | 1 |
会议主办者 | IEEE Nanotechnology Council; Michigan State University |
会议录 | 2010 IEEE Nanotechnology Materials and Devices Conference (NMDC 2010) |
会议录出版者 | IEEE |
会议录出版地 | Piscataway, NJ, USA |
语种 | 英语 |
ISBN号 | 978-1-4244-8896-4 |
源URL | [http://ir.sia.cn/handle/173321/8801] |
专题 | 沈阳自动化研究所_机器人学研究室 |
推荐引用方式 GB/T 7714 | Yu HB,Dong ZL,Li WJ. Nanoscale welding of MWCNTs for nanodevice applications[C]. 见:2010 4th IEEE Nanotechnology Materials and Devices Conference, NMDC2010. Monterey, CA, USA. October 12-15, 2010. |
入库方式: OAI收割
来源:沈阳自动化研究所
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