Parameter analysis of hot plate based on uniform design
文献类型：会议论文
| 作者 | Wang JZ(王靖震) ; Liu WJ(刘伟军)
|
| 出版日期 | 2011 |
| 会议名称 | 2011 International Conference on Electronics and Optoelectronics (ICEOE 2011) |
| 会议日期 | July 29-31, 2011 |
| 会议地点 | Dalian, China |
| 关键词 | hot plate uniform design regression |
| 页码 | 107-109 |
| 中文摘要 | In lithography process, wafers need to be baked on the hot plate. There are very high requirement to the temperature uniformity of hot plate surface. To the problem of choosing design parameters, the uniform design method and the simulation software ANSYS were used, the design parameters were analyzed on the various conditions. Then a regression model was obtained by dealing with these simulation data in quadratic regression. Test proven that the calculation result of the regression model is highly consistent with the result of simulation. So, the obtained regression model can be useful to choose the design parameters, it has practical value in the engineering. |
| 收录类别 | EI |
| 产权排序 | 1 |
| 会议录 | 2011 International Conference on Electronics and Optoelectronics (ICEOE 2011)
 |
| 会议录出版者 | IEEE |
| 会议录出版地 | Piscataway, NJ, USA |
| 语种 | 英语 |
| ISBN号 | 978-1-61284-275-2 |
| 源URL | [http://ir.sia.cn/handle/173321/7897]  |
| 专题 | 沈阳自动化研究所_装备制造技术研究室 |
| 推荐引用方式 GB/T 7714 | Wang JZ,Liu WJ. Parameter analysis of hot plate based on uniform design[C]. 见:2011 International Conference on Electronics and Optoelectronics (ICEOE 2011). Dalian, China. July 29-31, 2011. |
入库方式： OAI收割
来源：沈阳自动化研究所
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