Parameter analysis of hot plate in lithography process based on regression orthogonal experiment design
文献类型：会议论文
| 作者 | Wang JZ(王靖震) ; Liu WJ(刘伟军)
|
| 出版日期 | 2011 |
| 会议名称 | 2011 IEEE 18th International Conference on Industrial Engineering and Engineering Management (IE&EM 2011) |
| 会议日期 | September 3-5, 2011 |
| 会议地点 | Changchun, China |
| 关键词 | hot plate orthogonal experiment design regression |
| 页码 | 1717-1720 |
| 中文摘要 | In lithography process, wafers need to be baked on the hot plate. There are very high requirement to the temperature uniformity of hot plate surface. To the problem of choosing design parameters, the orthogonal experimental design method was used, the simulation software ANSYS was applied, the design parameters on the various conditions were analyzed, Then a regression model was obtained based these simulation data. It is consistent between the result of regression model and the result of simulation. The regression model indicates a better choice direction of the design parameters of hot plate. |
| 收录类别 | EI |
| 产权排序 | 1 |
| 会议主办者 | IEEE Beijing Sect. |
| 会议录 | 2011 IEEE 18th International Conference on Industrial Engineering and Engineering Management (IE&EM 2011)
 |
| 会议录出版者 | IEEE |
| 会议录出版地 | Piscataway, NJ, USA |
| 语种 | 英语 |
| ISBN号 | 978-1-61284-446-6 |
| 源URL | [http://ir.sia.cn/handle/173321/7898]  |
| 专题 | 沈阳自动化研究所_装备制造技术研究室 |
| 推荐引用方式 GB/T 7714 | Wang JZ,Liu WJ. Parameter analysis of hot plate in lithography process based on regression orthogonal experiment design[C]. 见:2011 IEEE 18th International Conference on Industrial Engineering and Engineering Management (IE&EM 2011). Changchun, China. September 3-5, 2011. |
入库方式： OAI收割
来源：沈阳自动化研究所
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