Application of silicon stress sensor in flip chip packaging system
文献类型：期刊论文
| 作者 | Jiang, Chengjie ; Xiao, Fei ; Yang, H ; Dou, Chuanguo |
| 刊名 | ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
 |
| 出版日期 | 2011 |
| 期号 | 0页码:932-936 |
| 通讯作者 | Jiang, C.(jiangcjI987@gmail.com) |
| 公开日期 | 2012-08-22 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/109175]  |
| 专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Jiang, Chengjie,Xiao, Fei,Yang, H,et al. Application of silicon stress sensor in flip chip packaging system[J]. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging,2011(0):932-936. |
| APA | Jiang, Chengjie,Xiao, Fei,Yang, H,&Dou, Chuanguo.(2011).Application of silicon stress sensor in flip chip packaging system.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging(0),932-936. |
| MLA | Jiang, Chengjie,et al."Application of silicon stress sensor in flip chip packaging system".ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging .0(2011):932-936. |
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