Development of deep reactive ion etching and Cu electroplating of tapered via for 3D integration
文献类型：期刊论文
| 作者 | Chen, Xiao ; Tang, Jiajie ; Xu, Gaowei ; Luo, Le |
| 刊名 | ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
 |
| 出版日期 | 2011 |
| 页码 | 65-67 |
| 通讯作者 | Chen, X.(chenxiao@mail.sim.ac.cn) |
| 收录类别 | EI-160 |
| 语种 | 英语 |
| 公开日期 | 2012-08-23 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/109207]  |
| 专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Chen, Xiao,Tang, Jiajie,Xu, Gaowei,et al. Development of deep reactive ion etching and Cu electroplating of tapered via for 3D integration[J]. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging,2011:65-67. |
| APA | Chen, Xiao,Tang, Jiajie,Xu, Gaowei,&Luo, Le.(2011).Development of deep reactive ion etching and Cu electroplating of tapered via for 3D integration.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging,65-67. |
| MLA | Chen, Xiao,et al."Development of deep reactive ion etching and Cu electroplating of tapered via for 3D integration".ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (2011):65-67. |
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