Wafer-level chip-to-wafer (C2W) integration of high-sensitivity MEMS and ICs
文献类型：期刊论文
| 作者 | Xu, Gaowei ; Yan, Peili ; Chen, Xiao ; Ning, Wenguo ; Luo,L ; Jiao,JW |
| 刊名 | ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
 |
| 出版日期 | 2011 |
| 页码 | 125-129 |
| 通讯作者 | Xu, G.(xugw@mail.sim.ac.cn) |
| 收录类别 | EI-081 |
| 语种 | 英语 |
| 公开日期 | 2012-08-23 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/109241]  |
| 专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Xu, Gaowei,Yan, Peili,Chen, Xiao,et al. Wafer-level chip-to-wafer (C2W) integration of high-sensitivity MEMS and ICs[J]. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging,2011:125-129. |
| APA | Xu, Gaowei,Yan, Peili,Chen, Xiao,Ning, Wenguo,Luo,L,&Jiao,JW.(2011).Wafer-level chip-to-wafer (C2W) integration of high-sensitivity MEMS and ICs.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging,125-129. |
| MLA | Xu, Gaowei,et al."Wafer-level chip-to-wafer (C2W) integration of high-sensitivity MEMS and ICs".ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (2011):125-129. |
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