On-chip integration of acceleration, pressure, and temperature composite sensor with a single-sided micromachining technique
文献类型：期刊论文
| 作者 | Wang, Quan ; Li,XX ; Li,T ; Bao, Minhang ; Zhou, Wei |
| 刊名 | Journal of Microelectromechanical Systems.
 |
| 出版日期 | 2011 |
| 卷号 | 20期号:1页码:42-52 |
| ISSN号 | 10577157 |
| 通讯作者 | Wang, Q. |
| 收录类别 | EI-150 |
| 语种 | 英语 |
| 公开日期 | 2012-08-23 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/109240]  |
| 专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wang, Quan,Li,XX,Li,T,et al. On-chip integration of acceleration, pressure, and temperature composite sensor with a single-sided micromachining technique[J]. Journal of Microelectromechanical Systems.,2011,20(1):42-52. |
| APA | Wang, Quan,Li,XX,Li,T,Bao, Minhang,&Zhou, Wei.(2011).On-chip integration of acceleration, pressure, and temperature composite sensor with a single-sided micromachining technique.Journal of Microelectromechanical Systems.,20(1),42-52. |
| MLA | Wang, Quan,et al."On-chip integration of acceleration, pressure, and temperature composite sensor with a single-sided micromachining technique".Journal of Microelectromechanical Systems. 20.1(2011):42-52. |
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