Design, fabrication of through silicon vias based on suspended photoresist thin film and its application in silicon interposer
文献类型：期刊论文
| 作者 | Wu, Ziyang ; Dou, Chuanguo ; Wu, Yanhong ; Yang, H |
| 刊名 | ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
 |
| 出版日期 | 2011 |
| 期号 | 0页码:400-403 |
| 通讯作者 | Wu, Z. |
| 公开日期 | 2012-08-23 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/109259]  |
| 专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wu, Ziyang,Dou, Chuanguo,Wu, Yanhong,et al. Design, fabrication of through silicon vias based on suspended photoresist thin film and its application in silicon interposer[J]. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging,2011(0):400-403. |
| APA | Wu, Ziyang,Dou, Chuanguo,Wu, Yanhong,&Yang, H.(2011).Design, fabrication of through silicon vias based on suspended photoresist thin film and its application in silicon interposer.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging(0),400-403. |
| MLA | Wu, Ziyang,et al."Design, fabrication of through silicon vias based on suspended photoresist thin film and its application in silicon interposer".ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging .0(2011):400-403. |
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