Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams
文献类型：期刊论文
| 作者 | Wu, ZY ; Yang, H ; Dou, CG ; Wu, YH ; Li, XX ; Wang, YL |
| 刊名 | 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11.2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
 |
| 出版日期 | 2011 |
| 期号 | 0页码:386-389 |
| 通讯作者 | Yang, H.(h.yang@mail.sim.ac.cn) |
| 公开日期 | 2012-08-28 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/109349]  |
| 专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wu, ZY,Yang, H,Dou, CG,et al. Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams[J]. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11.2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11,2011(0):386-389. |
| APA | Wu, ZY,Yang, H,Dou, CG,Wu, YH,Li, XX,&Wang, YL.(2011).Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams.2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11.2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11(0),386-389. |
| MLA | Wu, ZY,et al."Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams".2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11.2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 .0(2011):386-389. |
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