中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
An artificial immune pattern recognition approach for damage classification in structures

文献类型:会议论文

作者Zhou Y(周悦); Tang S(唐世); Zang CZ(臧传治); Zhou, Rui
出版日期2011
会议名称2nd International Conference of Electrical and Electronics Engineering, ICEEE 2011
会议日期December 1-2, 2011
会议地点Macau, China
关键词Damage detection Electronics engineering Electronics industry Industrial applications Information technology Learning algorithms Pattern recognition Research
页码11-17
中文摘要Structural Health Monitoring (SHM) is one of the research topics that have received growing interest in research communities. While a lot of efforts have been made in detecting damages in structures, very few researches have been conducted for the structure damage classification problem. This paper presents an artificial immune pattern recognition (AIPR) approach for the damage classification in structures. An AIPR-based Structure Damage Classifier (AIPR-SDC) has been developed, which incorporates several novel characteristics of the natural immune system. The immune learning algorithm can remember various data patterns by generating a set of memory cells that contain representative feature vectors for each pattern, which are extracted from the compressed data using the auto regression exogenous (ARX) algorithm. The AIPR-SDC approach has been tested using a benchmark structure proposed by the IASC-ASCE Structural Health Monitoring Task Group. The test results show the feasibility of using the AIPR-SDC method for the structure damage classification. © 2012 Springer-Verlag.
收录类别EI
产权排序2
会议主办者International Industrial Electronics Center
会议录Lecture Notes in Electrical Engineering
会议录出版者Springer Verlag
会议录出版地Heidelberg, Germany
语种英语
ISSN号1876-1100
ISBN号978-3-642-26000-1
源URL[http://ir.sia.cn/handle/173321/9893]  
专题沈阳自动化研究所_工业信息学研究室
推荐引用方式
GB/T 7714
Zhou Y,Tang S,Zang CZ,et al. An artificial immune pattern recognition approach for damage classification in structures[C]. 见:2nd International Conference of Electrical and Electronics Engineering, ICEEE 2011. Macau, China. December 1-2, 2011.

入库方式: OAI收割

来源:沈阳自动化研究所

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