Finite element modal analysis of the FPD glass substrates handling robot
文献类型：会议论文
| 作者 | Cheng L(程丽); Wang HG(王洪光)
|
| 出版日期 | 2012 |
| 会议名称 | 2012 9th IEEE International Conference on Mechatronics and Automation, ICMA 2012 |
| 会议日期 | August 5-8, 2012 |
| 会议地点 | Chengdu, China |
| 关键词 | Finite element method Flat panel displays Natural frequencies Robots Substrates |
| 页码 | 1341-1346 |
| 通讯作者 | 程丽 |
| 中文摘要 | A planar multi-joint handling robot for FPD (Flat Panel Display) glass substrates with heavy load and high precision is introduced. In order to investigate the vibration characteristics of this robot, finite element modal analysis with Solidworks simulation is presented. First of all, the mechanical structure of the new generation FPD glass substrates handling robot is introduced. Then, the finite element model is established and the modal analysis procedure is introduced in detail. In a given typical configuration, the first 10th natural frequencies and corresponding mode shapes of the robot are obtained. Based on the calculation results, relative weak parts of vibration for the robot are pointed and the improving suggestions are put forward. Furthermore, the natural frequencies of the key components are analyzed and the modal matching analysis is given. The analysis results indicate that the modal distribution of the mechanical structure of this new generation FPD glass substrates handling robot is reasonable. |
| 收录类别 | EI |
| 产权排序 | 1 |
| 会议主办者 | IEEE Robotics and Automation Society; Harbin Institute of Technology; Kagawa University |
| 会议录 | 2012 IEEE International Conference on Mechatronics and Automation, ICMA 2012
 |
| 会议录出版者 | IEEE Computer Society |
| 会议录出版地 | Washington, DC, United States |
| 语种 | 英语 |
| ISBN号 | 978-1-4673-1277-6 |
| 源URL | [http://ir.sia.cn/handle/173321/10095]  |
| 专题 | 沈阳自动化研究所_空间自动化技术研究室 |
| 推荐引用方式 GB/T 7714 | Cheng L,Wang HG. Finite element modal analysis of the FPD glass substrates handling robot[C]. 见:2012 9th IEEE International Conference on Mechatronics and Automation, ICMA 2012. Chengdu, China. August 5-8, 2012. |
入库方式： OAI收割
来源：沈阳自动化研究所
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