Numerical Simulation of Temperature Field and Experimental Inquiry of TC4 Titanium Alloy Laser Rapid Forming
文献类型:会议论文
作者 | Lai YB(来佑彬)![]() ![]() ![]() ![]() ![]() |
出版日期 | 2012 |
会议名称 | 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies |
会议日期 | April 26-29, 2012 |
会议地点 | Xiamen, China |
关键词 | laser rapid forming APDL element life and death technique temperature field numerical simulation temperature gradients |
页码 | 8 pp. |
通讯作者 | 来佑彬 |
中文摘要 | In order to seek the reasonable Laser forming process parameters of TC4 titanium alloy, and to control forming quality, based on the element life and death technique of finite element methods (FEM), detailed numerical simulation of single track and multi-layer temperature field of TC4 titanium alloy during laser rapid forming was conducted with ANSYS parametric design language (APDL). And get the distribution of temperature field and temperature gradients. The calculated results show that the distribution of temperature field changed with the movement of laser beams and the heat affected area have been expanded along with the increase of the scanning time, temperature increase gradually and temperature gradients obviously changed in molten pool area. The temperature gradients in sample are mainly along deposition direction. In the end, carry on an experimentation research testing and verifying according to the simulation parameters, proof that the results can meet the actual situation analysis results, and forming a sample with good performance. |
收录类别 | EI ; CPCI(ISTP) |
产权排序 | 1 |
会议录 | SPIE
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会议录出版者 | Proc SPIE. 8419 |
会议录出版地 | SPIE |
语种 | 英语 |
ISSN号 | 0277-786X |
ISBN号 | 978-0-8194-9098-8 |
WOS记录号 | WOS:000326600500005 |
源URL | [http://ir.sia.cn/handle/173321/10150] ![]() |
专题 | 沈阳自动化研究所_装备制造技术研究室 |
推荐引用方式 GB/T 7714 | Lai YB,Liu WJ,Kong Y,et al. Numerical Simulation of Temperature Field and Experimental Inquiry of TC4 Titanium Alloy Laser Rapid Forming[C]. 见:6th International Symposium on Advanced Optical Manufacturing and Testing Technologies. Xiamen, China. April 26-29, 2012. |
入库方式: OAI收割
来源:沈阳自动化研究所
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