Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding
文献类型：期刊论文
| 作者 | Wu, GQ ; Xu, DH ; Xiong, B ; Wang, YC ; Wang, YL ; Ma, YL |
| 刊名 | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
 |
| 出版日期 | 2012 |
| 卷号 | 21期号:6页码:1484-1491 |
| 关键词 | Bulk mode glass frit bonding microelectromechanical systems (MEMS) redistribution resonators silicon bumps vacuum package wafer-level package |
| ISSN号 | 1057-7157 |
| 通讯作者 | Wu, GQ (reprint author), Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai 200050, Peoples R China. |
| 中文摘要 | A wafer-level vacuum package with silicon bumps and electrical feedthroughs on the cap wafer is developed for a microelectromechanical systems (MEMS) resonator device. A MEMS resonator wafer and a cap wafer are bonded together in a vacuum chamber using gl |
| 学科主题 | Engineering |
| 收录类别 | 2012SCI-004 |
| 原文出处 | 10.1109/JMEMS.2012.2211572 |
| 语种 | 英语 |
| 公开日期 | 2013-04-23 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/114888]  |
| 专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wu, GQ,Xu, DH,Xiong, B,et al. Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding[J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS,2012,21(6):1484-1491. |
| APA | Wu, GQ,Xu, DH,Xiong, B,Wang, YC,Wang, YL,&Ma, YL.(2012).Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS,21(6),1484-1491. |
| MLA | Wu, GQ,et al."Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding".JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 21.6(2012):1484-1491. |
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