Development of wafer level glass frit bonding by using barrier trench technology and precision screen printing
文献类型：期刊论文
| 作者 | Chen, X ; Yan, PL ; Tang, JJ ; Xu, GW ; Luo, L |
| 刊名 | MICROELECTRONIC ENGINEERING
 |
| 出版日期 | 2012 |
| 卷号 | 100页码:6-11 |
| 关键词 | MEMS WLP Glass frit bonding Barrier trench technology (BTT) |
| ISSN号 | 0167-9317 |
| 通讯作者 | Luo, L (reprint author), Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China. |
| 中文摘要 | A new technology in wafer-level packaging by glass frit bonding is developed for wafer level encapsulation of MEMS devices. To improve the uniformity of the dimension of glass frit, a new barrier trench technology (BTT) is developed during bonding process |
| 学科主题 | Engineering; Science & Technology - Other Topics; Optics; Physics |
| 收录类别 | 2012SCI-007 |
| 原文出处 | 10.1016/j.mee.2012.07.116 |
| 语种 | 英语 |
| 公开日期 | 2013-04-23 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/114889]  |
| 专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Chen, X,Yan, PL,Tang, JJ,et al. Development of wafer level glass frit bonding by using barrier trench technology and precision screen printing[J]. MICROELECTRONIC ENGINEERING,2012,100:6-11. |
| APA | Chen, X,Yan, PL,Tang, JJ,Xu, GW,&Luo, L.(2012).Development of wafer level glass frit bonding by using barrier trench technology and precision screen printing.MICROELECTRONIC ENGINEERING,100,6-11. |
| MLA | Chen, X,et al."Development of wafer level glass frit bonding by using barrier trench technology and precision screen printing".MICROELECTRONIC ENGINEERING 100(2012):6-11. |
入库方式： OAI收割
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