Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps
文献类型：期刊论文
| 作者 | Wu, GQ ; Xu, DH ; Xiong, B ; Wang, YL |
| 刊名 | IEEE ELECTRON DEVICE LETTERS
 |
| 出版日期 | 2012 |
| 卷号 | 33期号:8页码:1177-1179 |
| 关键词 | Redistribution of electrical interconnection silicon bumps wafer-level packaging 3-D packaging |
| ISSN号 | 0741-3106 |
| 通讯作者 | Wu, GQ (reprint author), Chinese Acad Sci, State Key Lab Transducer Technol, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China. |
| 中文摘要 | In this letter, an approach to the redistribution of electrical interconnections is investigated for potential application in 3-D wafer-level packaging. A cap wafer with silicon bumps and electrical feedthroughs is bonded together with a device wafer usin |
| 学科主题 | Engineering |
| 收录类别 | 2012SCI-078 |
| 原文出处 | 10.1109/LED.2012.2200231 |
| 语种 | 英语 |
| 公开日期 | 2013-04-23 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/114907]  |
| 专题 | 上海微系统与信息技术研究所_微系统技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wu, GQ,Xu, DH,Xiong, B,et al. Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps[J]. IEEE ELECTRON DEVICE LETTERS,2012,33(8):1177-1179. |
| APA | Wu, GQ,Xu, DH,Xiong, B,&Wang, YL.(2012).Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps.IEEE ELECTRON DEVICE LETTERS,33(8),1177-1179. |
| MLA | Wu, GQ,et al."Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps".IEEE ELECTRON DEVICE LETTERS 33.8(2012):1177-1179. |
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