中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
A novel sandwich capacitive accelerometer with a symmetrical structure fabricated from a D-SOI wafer

文献类型:期刊论文

作者Zhou, XF ; Che, LF ; Wu, J ; Li, XL ; Wang, YL
刊名JOURNAL OF MICROMECHANICS AND MICROENGINEERING
出版日期2012
卷号22期号:8页码:85031
ISSN号0960-1317
通讯作者Che, LF (reprint author), Chinese Acad Sci, Sci & Technol Microsyst Lab, State Key Lab Transducer Technol, Shanghai Inst Microsyst & Informat Technol, 865 Changning Rd, Shanghai 200050, Peoples R China.
中文摘要This paper presents a novel sandwich capacitance accelerometer with a symmetrical double-sided beam-mass structure. The symmetrical beam-mass structure is fabricated from a double-device-layer silicon-on-insulate (D-SOI) wafer. The proof mass is suspended
学科主题Engineering; Science & Technology - Other Topics; Instruments & Instrumentation; Materials Science; Mechanics
收录类别2012SCI-081
原文出处10.1088/0960-1317/22/8/085031
语种英语
公开日期2013-04-23
源URL[http://ir.sim.ac.cn/handle/331004/114908]  
专题上海微系统与信息技术研究所_微系统技术_期刊论文
推荐引用方式
GB/T 7714
Zhou, XF,Che, LF,Wu, J,et al. A novel sandwich capacitive accelerometer with a symmetrical structure fabricated from a D-SOI wafer[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2012,22(8):85031.
APA Zhou, XF,Che, LF,Wu, J,Li, XL,&Wang, YL.(2012).A novel sandwich capacitive accelerometer with a symmetrical structure fabricated from a D-SOI wafer.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,22(8),85031.
MLA Zhou, XF,et al."A novel sandwich capacitive accelerometer with a symmetrical structure fabricated from a D-SOI wafer".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 22.8(2012):85031.

入库方式: OAI收割

来源:上海微系统与信息技术研究所

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