Bonding method using solder composed of multiple alternating gold and tin layers
文献类型：专利
| 作者 | KATZ, AVISHAY; LEE, CHIEN-HSUN; TAI, KING LIEN; WONG, YIU-MAN |
| 发表日期 | 1993-05-19 |
| 专利号 | EP0542475A1 |
| 著作权人 | AT&T CORP. |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Bonding method using solder composed of multiple alternating gold and tin layers |
| 英文摘要 | A device (10) such as a laser is bonded to a submount (20) such as diamond by a process in which the submount is successively coated with an adhesion layer (21) such as titanium, a barrier layer (22) such as nickel, and a gold-tin solder composite layer (23) formed by sequential deposition on the barrier layer a number (preferably greater than seven) of multiple alternating layers (23.1, 23.2,..., 23.11) of gold and tin, the last layer (23.11) being gold having a thickness that is equal to approximately one-half or less than the thickness of the (next-to-last) tin layer that it contacts immediately beneath it. The bonding is performed under applied heat that is sufficient to melt the solder-metallization composite layer. Prior to the bonding, (in addition to the submount) the device advantageously is coated with a gold layer (13). |
| 公开日期 | 1993-05-19 |
| 申请日期 | 1992-11-05 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/64364]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AT&T CORP. |
| 推荐引用方式 GB/T 7714 | KATZ, AVISHAY,LEE, CHIEN-HSUN,TAI, KING LIEN,et al. Bonding method using solder composed of multiple alternating gold and tin layers. EP0542475A1. 1993-05-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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