中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Numerical simulation analysis and optimization of modular joint temperature field based on ANSYS

文献类型:会议论文

作者Zhang T(张涛)1,2,5; Xu, Wenjing4; Huang ZZ(黄子昭)1,3,5; Yang ZQ(杨振强)2; Chen XY(陈希有)2; Zhao BJ(赵冰洁)1,5; Zhang HL(张华良)1,5
出版日期2021
会议日期May 22-24, 2021
会议地点Kunming, China
关键词harmonic reducer modular joint Finite Element Method Temperature Field ANSYS.
页码3394-3399
英文摘要In the low-speed state, temperature change has a significant impact on the working efficiency of a harmonic reducer. Therefore, since modular joints used in collaborative robots arbitrarily arrange nodes and meshes through the Finite Element Method (FEM), a temperature field calculation model of the integrated joints was established in this study. By utilizing the ANSYS software, a steady-state temperature field distribution of the modular joint was calculated, and the temperature rise of the harmonic reducer was reduced by changing the thermal resistance. Comparing the results demonstrated that the method was effective, which is very important for the safe operation and performance improvement of modular joints.
源文献作者Chinese Association of Automation, State Key Laboratory of Synthetical Automation for Process Industries ; IEEE Control Systems Society (CSS) ; IEEE Technical Committee on Control Theory ; Northeastern University
产权排序1
会议录2021 33rd Chinese Control and Decision Conference (CCDC)
会议录出版者IEEE
会议录出版地New York
语种英语
ISBN号978-1-6654-4089-9
源URL[http://ir.sia.cn/handle/173321/30561]  
专题沈阳自动化研究所_工业控制网络与系统研究室
通讯作者Zhang T(张涛)
作者单位1.Key Laboratory of Networked Control Systems, Chinese Academy of Sciences, Shenyang 110016, China
2.School of Electrical Engineering, Dalian University of Technology, Dalian 116024, China
3.University of Chinese Academy of Sciences, Beijing 100049, China
4.CRRC DALIAN RD CO., LTD., Dalian 116024, China
5.Institutes for Robotics and Intelligent Manufacturing, Chinese Academy of Sciences, Shenyang 110016, China
推荐引用方式
GB/T 7714
Zhang T,Xu, Wenjing,Huang ZZ,et al. Numerical simulation analysis and optimization of modular joint temperature field based on ANSYS[C]. 见:. Kunming, China. May 22-24, 2021.

入库方式: OAI收割

来源:沈阳自动化研究所

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