Semiconductor Bonding Equipment Grouping Model Based on Processing Task Matching
文献类型：会议论文
| 作者 | Gao ZJ(高治军)2; Si W(司雯)2; Han ZH(韩忠华)1,2,3,4 ; Peng, Jiayu2; Zheng, Hongzhi5
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| 出版日期 | 2019 |
| 会议日期 | July 13-15, 2019 |
| 会议地点 | Tianjin, China |
| 关键词 | Semiconductor package line Graph theory Association matrix Device grouping |
| 页码 | 195-204 |
| 英文摘要 | For the problem that the fixed equipment grouping on the semiconductor packaging line cannot achieve the dynamic matching with the processing capacity of the processing task, this paper applies the graph theory method to the equipment grouping, and uses the topological structure of the graph theory to establish the equipment matrix. Also it uses the adjacency matrix to generate the relationship matrix between devices. And the device is grouped with closed position constraints and matching constraints between device types and processing types. A semiconductor bonding device grouping model based on processing task matching is established. The grouping model is simulated under different processing tasks, and it is verified that the equipment grouping model can realize dynamic grouping. |
| 产权排序 | 2 |
| 会议录 | Proceedings of the 11th International Conference on Modelling, Identification and Control, ICMIC 2019
 |
| 会议录出版者 | Springer |
| 会议录出版地 | Berlin |
| 语种 | 英语 |
| ISSN号 | 1876-1100 |
| ISBN号 | 978-981-15-0473-0 |
| WOS记录号 | WOS:000612991700019 |
| 源URL | [http://ir.sia.cn/handle/173321/26138]  |
| 专题 | 沈阳自动化研究所_数字工厂研究室 |
| 通讯作者 | Si W(司雯) |
| 作者单位 | 1.Department of Digital Factory, Shenyang Institute of Automation, The Chinese Academy of Sciences (CAS), Shenyang 110016, China 2.Faculty of Information and Control Engineering, Shenyang Jianzhu University, Shenyang 110168, China 3.Key Laboratory of Network Control System, Chinese Academy of Sciences, Shenyang, Liaoning 110016, China 4.Institutes for Robotics and Intelligent Manufacturing, Chinese Academy of Sciences, Shenyang, Liaoning 110016, China 5.School of Mechanical Engineering, Beijing Institute of Technology Beijing, Beijing 100081, China |
| 推荐引用方式 GB/T 7714 | Gao ZJ,Si W,Han ZH,et al. Semiconductor Bonding Equipment Grouping Model Based on Processing Task Matching[C]. 见:. Tianjin, China. July 13-15, 2019. |
入库方式： OAI收割
来源：沈阳自动化研究所
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