Stress reduction of diamond-like carbon by Si incorporation: A molecular dynamics study
文献类型:会议论文
作者 | Li, Xiao-Wei; Joe, Min-Woong; Wang, Ai-Ying; Lee, Kwang-Ryeol |
出版日期 | 2013 |
会议日期 | SEP 19-22, 2011 |
关键词 | TETRAHEDRAL AMORPHOUS-CARBON TRIBOLOGICAL PROPERTIES STRUCTURAL-PROPERTIES DLC COATINGS THIN-FILMS DEPOSITION GROWTH MODEL SIMULATIONS ENERGY |
卷号 | 228 |
DOI | 10.1016/j.surfcoat.2012.06.031 |
英文摘要 | The residual stress and atomic bond structure of Si-incorporated diamond-like carbon films were investigated by the molecular dynamics simulation using Tersoff interatomic potential. The effect of Si incorporation into amorphous carbon matrix was analyzed for the various Si concentrations ranging from 0 to 2.1 at.%. The present simulation revealed that the incorporation of a small amount of Si significantly reduced the residual compressive stress: when the Si content was 0.54 at.%, the minimal compressive stress of 1.4 GPa was observed. Structural analysis using the radial distribution function and the bond angle distribution indicated that the compressive stress reduction resulted from the relaxation of highly distorted bond angles less than 109.5 degrees. (C) 2012 Elsevier B.V. All rights reserved. |
学科主题 | Materials Science ; Physics |
ISSN号 | 0257-8972 |
源URL | [http://ir.nimte.ac.cn/handle/174433/23596] ![]() |
专题 | 会议专题 会议专题_会议论文 |
推荐引用方式 GB/T 7714 | Li, Xiao-Wei,Joe, Min-Woong,Wang, Ai-Ying,et al. Stress reduction of diamond-like carbon by Si incorporation: A molecular dynamics study[C]. 见:. SEP 19-22, 2011. |
入库方式: OAI收割
来源:宁波材料技术与工程研究所
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