中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
基于聚3-己基噻吩和C60衍生物的光敏混合聚合物光电导薄膜操控芯片及制备方法

文献类型:专利

作者曲艳丽; 董再励; 李文荣; 刘柱; 周磊; 王淑娥; 梁文峰
发表日期2012-05-30
专利国别中国
专利号CN102478581A
专利类型发明
产权排序1
权利人中国科学院沈阳自动化研究所
其他题名Photosensitive mixed polymer photoconductive film control chip based on poly[3-hexylthiophene] (P3HT) and C60 derivative and preparation method thereof
中文摘要本发明公开一种基于聚3-己基噻吩(P3HT)和C60衍生物PCBM的光敏混合聚合物光电导薄膜操控芯片及制备方法,所述芯片包括上层基片、下层基片、液体腔;所述上层基片设置上导电薄膜层;所述下层基片设置一基于P3HT:PCBM的光电导薄膜层及下导电薄膜层;所述上导电薄膜层和下导电薄膜层均设置连接外部交流电压的引线;所述光电导薄膜层的上面设置绝缘层,下面设置过渡层。本发明具有如下特点:1.制备工艺非常简单,可在常温下进行,对制备环境无特殊要求,因此,大大降低了芯片的制备周期和成本;2.由于利用了光敏材料的光电导特性,降低了芯片的制备成本;3.通过计算机控制投影图像照射到芯片上生成虚拟电极,可实现完全数字化的操作。
是否PCT专利
英文摘要The invention discloses a photosensitive mixed polymer photoconductive film control chip based on the P3HT and a C60 derivative PCBM ([6,6-phenyl-C61-butyric acid methyl ester]) and a preparation method thereof. The chip is characterized in that the chip comprises an upper substrate, a lower substrate and a liquid chamber the upper substrate is provided with a conductive film layer the lower substrate is provided with a photoconductive film layer based on P3HT:PCBM and a lower conductive film layer the upper conductive film layer and the lower conductive film layer are respectively provided with a lead wire, and the lead wires are connected with an external AC power supply and an insulation layer is arranged on the photoconductive film layer, and a transition layer is arranged under the photoconductive film layer. According to the invention, the preparation method which is very simple can be carried out at normal temperature and has no special requirements on preparation environment, so the preparation period and the preparation cost of the chip are substantially reduced the preparation cost of the chip is reduced by utilizing the photoconductive characteristic of the photosensitive material and a computer controls the irradiation of a projection image to the chip to generate a virtual electrode, so the completely digitalized operation can be realized.
申请日期2010-11-29
语种中文
专利申请号CN201010562995.2
专利代理沈阳科苑专利商标代理有限公司 21002
源URL[http://ir.sia.cn/handle/173321/13763]  
专题沈阳自动化研究所_机器人学研究室
推荐引用方式
GB/T 7714
曲艳丽,董再励,李文荣,等. 基于聚3-己基噻吩和C60衍生物的光敏混合聚合物光电导薄膜操控芯片及制备方法. CN102478581A. 2012-05-30.

入库方式: OAI收割

来源:沈阳自动化研究所

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