Experimental study on residual stress in titanium alloy laser additive manufacturing
文献类型：会议论文
| 作者 | Lai YB(来佑彬) ; Liu WJ(刘伟军); Zhao JB(赵吉宾); Zhao YH(赵宇辉); Wang FY(王福雨); Han WC(韩文超)
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| 出版日期 | 2013 |
| 会议名称 | 2013 International Conference on Mechanical Engineering, Industrial Materials and Industrial Electronics, MII 2013 |
| 会议日期 | September 1-2, 2013 |
| 会议地点 | Hong Kong, China |
| 关键词 | Industrial electronics Manufacture Mechanical engineering Scanning Stress measurement Titanium alloys |
| 页码 | 20-26 |
| 中文摘要 | The residual stress in laser additive manufacturing titanium alloy sample was measured using indentation stress measurement method. The residual stress variation formulas was fitted with the major process parameters such as laser power, scanning speed, the powder feed rate etc. It was studied that the influence of processing layers and scanning corner on the specimen residual stress. The results show that the specimen residual stress increases first and then decreases with the increase of processing layers, and the maximum appears in the fiftieth layer, in addition, the residual stress in the side of corner sample is mainly pressure stress, the maximum appearing in the 150°scanning angle, the minimum appearing in the 120°scanning angle. Therefore, it can reduce the overall sample residual stress effectively by an obtuse angle scanning trajectory. © (2013) Trans Tech Publications, Switzerland. |
| 收录类别 | EI |
| 产权排序 | 1 |
| 会议主办者 | Information Engineering Research Institute, USA; Trans Tech Publications inc. |
| 会议录 | Applied Mechanics and Materials
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| 会议录出版者 | Trans Tech Publications Ltd, |
| 会议录出版地 | Zurich-Durnten, Switzerland |
| 语种 | 英语 |
| ISSN号 | 1660-9336 |
| ISBN号 | 978-3-03785-893-6 |
| 源URL | [http://ir.sia.cn/handle/173321/13829]  |
| 专题 | 沈阳自动化研究所_装备制造技术研究室 |
| 推荐引用方式 GB/T 7714 | Lai YB,Liu WJ,Zhao JB,et al. Experimental study on residual stress in titanium alloy laser additive manufacturing[C]. 见:2013 International Conference on Mechanical Engineering, Industrial Materials and Industrial Electronics, MII 2013. Hong Kong, China. September 1-2, 2013. |
入库方式： OAI收割
来源：沈阳自动化研究所
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