Single Cu nanowire assembled by microdroplet dielectrophoresis on ultrahigh tensible microelectrodes
文献类型：期刊论文
| 作者 | Huang CL(黄超雷) ; Zeng HJ(曾鸿江); Tian XJ(田孝军); Liu J(刘杰); Dong ZL(董再励); Li T(李铁); Wang YL(王跃林)
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| 刊名 | CHINESE SCIENCE BULLETIN
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| 出版日期 | 2014 |
| 卷号 | 59期号:5-6页码:577-584 |
| 关键词 | Single nanowire assembly Microdroplet dielectrophoresis Ultrahigh tensible microelectrode Dynamic tensile properties Atomic chain |
| ISSN号 | 1001-6538 |
| 产权排序 | 1 |
| 通讯作者 | 田孝军 |
| 中文摘要 | At present, study on dynamic tensile properties and atomic chain fabrication of single nanowire, for understanding its dynamic tensile properties and unique physical properties of atomic chain to fabricate atom scale devices, is one of frontier research issues in nanoscale science. However, how to assemble single nanowire on a tensible microstructure becomes one of the most difficult problems, which severely restricts the development of this research field. In this paper, after the ultrahigh tensible microelectrode chip is fabricated by MEMS technology, hexamethyldisilazane is utilized to improve hydrophobicity of the chip, and then a microdroplet dielectrophoresis experimental platform and technology is developed to assemble single nanowire on the sensible microelectrode. Experimental results show that accurate and efficient assembly of single Cu nanowire is realized, which contribute greatly to the further research of dynamic tensile properties and atomic chain fabrication. And for guiding the assembly experiments, finite element technology is also utilized to analyze the local microelectro field around the microelectrodes during dieletrophoresis experiments. |
| WOS标题词 | Science & Technology |
| 类目[WOS] | Multidisciplinary Sciences |
| 研究领域[WOS] | Science & Technology - Other Topics |
| 关键词[WOS] | COPPER NANOWIRES ; QUANTUM DOTS ; DEVICES ; SCALE |
| 收录类别 | SCI |
| 资助信息 | National Natural Science Foundation of China [51375477, 61375091]; CAS FEA International Partnership Program for Creative Research Teams |
| 语种 | 英语 |
| WOS记录号 | WOS:000331563100017 |
| 源URL | [http://ir.sia.cn/handle/173321/14729]  |
| 专题 | 沈阳自动化研究所_机器人学研究室 |
| 推荐引用方式 GB/T 7714 | Huang CL,Zeng HJ,Tian XJ,et al. Single Cu nanowire assembled by microdroplet dielectrophoresis on ultrahigh tensible microelectrodes[J]. CHINESE SCIENCE BULLETIN,2014,59(5-6):577-584. |
| APA | Huang CL.,Zeng HJ.,Tian XJ.,Liu J.,Dong ZL.,...&Wang YL.(2014).Single Cu nanowire assembled by microdroplet dielectrophoresis on ultrahigh tensible microelectrodes.CHINESE SCIENCE BULLETIN,59(5-6),577-584. |
| MLA | Huang CL,et al."Single Cu nanowire assembled by microdroplet dielectrophoresis on ultrahigh tensible microelectrodes".CHINESE SCIENCE BULLETIN 59.5-6(2014):577-584. |
入库方式： OAI收割
来源：沈阳自动化研究所
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