Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication
文献类型:期刊论文
作者 | Xu K(许可); Tian XJ(田孝军)![]() ![]() ![]() ![]() |
刊名 | Science China Technological Sciences
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出版日期 | 2014 |
卷号 | 57期号:4页码:734-737 |
关键词 | Computer software Electrodes Electrophoresis Nanoelectronics Thermoelectric equipment |
ISSN号 | 1674-7321 |
产权排序 | 1 |
通讯作者 | 田孝军 |
中文摘要 | To improve the efficiency of nano-electronic device fabrication, a new method named floating electrical potential assembly is proposed to realize large-scale assembly of Cu/CuO nanowires. The simulation of floating electrical potential distribution on the micro-electrode chip is performed by COMSOL software, and the simulation result shows that the coupled electrical potential on the floating drain electrodes is very close to the original electrical potential applied on the gate electrode, which means that the method can provide di-electrophoresis (DEP) force for all the electrode pairs at one time, thus realizing large-scale assembly at one time. With Cu/CuO nanowires well dispersed and micro-electrode chip fabrication, nanowires assembly experiments are performed and the experimental results show that Cu/CuO nanowires are assembled at hundreds of micro-electrodes pairs at one time, and the success rate of nanowires assembly also reaches 90%. © 2014 Science China Press and Springer-Verlag Berlin Heidelberg. |
WOS标题词 | Science & Technology ; Technology |
类目[WOS] | Engineering, Multidisciplinary ; Materials Science, Multidisciplinary |
研究领域[WOS] | Engineering ; Materials Science |
关键词[WOS] | PERFORMANCE ; SENSORS |
收录类别 | SCI ; EI |
语种 | 英语 |
WOS记录号 | WOS:000334400500012 |
源URL | [http://ir.sia.cn/handle/173321/14749] ![]() |
专题 | 沈阳自动化研究所_机器人学研究室 |
推荐引用方式 GB/T 7714 | Xu K,Tian XJ,Yu HB,et al. Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication[J]. Science China Technological Sciences,2014,57(4):734-737. |
APA | Xu K,Tian XJ,Yu HB,Yang Y,Zhou L,&Liu LQ.(2014).Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication.Science China Technological Sciences,57(4),734-737. |
MLA | Xu K,et al."Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication".Science China Technological Sciences 57.4(2014):734-737. |
入库方式: OAI收割
来源:沈阳自动化研究所
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