中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication

文献类型:期刊论文

作者Xu K(许可); Tian XJ(田孝军); Yu HB(于海波); Yang Y(杨洋); Zhou L(周磊); Liu LQ(刘连庆)
刊名Science China Technological Sciences
出版日期2014
卷号57期号:4页码:734-737
关键词Computer software Electrodes Electrophoresis Nanoelectronics Thermoelectric equipment
ISSN号1674-7321
产权排序1
通讯作者田孝军
中文摘要To improve the efficiency of nano-electronic device fabrication, a new method named floating electrical potential assembly is proposed to realize large-scale assembly of Cu/CuO nanowires. The simulation of floating electrical potential distribution on the micro-electrode chip is performed by COMSOL software, and the simulation result shows that the coupled electrical potential on the floating drain electrodes is very close to the original electrical potential applied on the gate electrode, which means that the method can provide di-electrophoresis (DEP) force for all the electrode pairs at one time, thus realizing large-scale assembly at one time. With Cu/CuO nanowires well dispersed and micro-electrode chip fabrication, nanowires assembly experiments are performed and the experimental results show that Cu/CuO nanowires are assembled at hundreds of micro-electrodes pairs at one time, and the success rate of nanowires assembly also reaches 90%. © 2014 Science China Press and Springer-Verlag Berlin Heidelberg.
WOS标题词Science & Technology ; Technology
类目[WOS]Engineering, Multidisciplinary ; Materials Science, Multidisciplinary
研究领域[WOS]Engineering ; Materials Science
关键词[WOS]PERFORMANCE ; SENSORS
收录类别SCI ; EI
语种英语
WOS记录号WOS:000334400500012
源URL[http://ir.sia.cn/handle/173321/14749]  
专题沈阳自动化研究所_机器人学研究室
推荐引用方式
GB/T 7714
Xu K,Tian XJ,Yu HB,et al. Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication[J]. Science China Technological Sciences,2014,57(4):734-737.
APA Xu K,Tian XJ,Yu HB,Yang Y,Zhou L,&Liu LQ.(2014).Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication.Science China Technological Sciences,57(4),734-737.
MLA Xu K,et al."Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication".Science China Technological Sciences 57.4(2014):734-737.

入库方式: OAI收割

来源:沈阳自动化研究所

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