半导体封装生产线排产方法研究与实现
文献类型：学位论文
| 作者 | 王玉
|
| 学位类别 | 硕士 |
| 答辩日期 | 2014-11-14 |
| 授予单位 | 中国科学院沈阳自动化研究所 |
| 授予地点 | 中国科学院沈阳自动化研究所 |
| 导师 | 史海波 |
| 关键词 | 半导体封装生产线 生产排产 多叉树随机森林算法 排产系统 |
| 其他题名 | Research and Implementation on Scheduling in Semiconductor Assembly Manufacturing |
| 学位专业 | 计算机应用技术 |
| 中文摘要 | 我国现在已经成为全球主要的半导体封装产业基地之一，半导体封装测试产业也是中国半导体产业的重要支撑点和我国国民经济的重要组成部分。但是，伴随经济全球化和国内市场经济的快速发展，半导体封装企业生产的产品的数量和种类与日俱增，用户个性化需求不断增长，各类生产制造活动都趋向于专业分工、跨区域合作，同时国内企业的管理水平相对低下、劳动生产率偏低，与国际大型企业相比存在着显著的差距。这给我国的半导体封装企业带来了很大的挑战。 半导体封装企业的生产具有多品种、小批量、生产周期短、设备数量庞大的等特点，这些特点使得通过实行自动排产技术提高生产效益成为必要。此外,国外半导体企业基本上都已经采用了先进的排产系统,在很大程度上取得了显著的效果。所以，进行半导体封装测试生产线的排产技术研究，对于促进我国关键技术自主化进程和打破国际垄断有着重要的意义。 该文以半导体封装企业为研究对象，开展了一系列研究工作。首先介绍了计划排产技术的发展现状和趋势，并详细分析了当前常用的几种计划排产方法和半导体封装生产线的关键技术；通过对半导体封装企业的实际计划排产问题进行分析研究,提出了基于多叉树的产品类型分类的优化排产方法；其次，在此基础上结合半导体封装企业的工艺流程和计划排产的特征,对半导体封装生产线排产系统系统进行总体设计。完成业务流程、功能结构和数据流程等分析，确定了系统的总体设计方案，建立了中心化的计划排产系统结构和系统设计。最后，开发实施了某半导体封装企业的排产系统。 |
| 索取号 | F253/W38/2015 |
| 英文摘要 | China has now become one of the world's major semiconductor packaging industry base, and Semiconductor packaging industry is also China's semiconductor industry important strong point and an important part of the national economy. But, along with the rapid development of economic globalization and domestic market economy, semiconductor packaging enterprises increasing the number and variety of products, the user increasing demand for personalized, all kinds of manufacturing activity tends to be the professional division of labor, cross-regional cooperation, at the same time, domestic enterprises management level is relatively low, productivity is low, compared with the international big companies there is a significant gap. This for semiconductor packaging enterprises in China has brought great challenges. Semiconductor packaging enterprise's production has many varieties, small batch, short production cycle, equipment, a large number of characteristics, these characteristics make by implementing automatic production scheduling technology is necessary to improve the production efficiency. In addition, Semiconductor companies abroad, moreover, is basically has adopted the advanced production scheduling system, to a great extent, has obtained the remarkable effect. So, the production of semiconductor packaging test production line is studied, to promote democracy process and key technology in China is of great significance to break international monopoly. Based on semiconductor packaging enterprises as the research object, has carried out a series of research work. First introduced the plan development status and trend of the technology of production scheduling, and analyzes in detail the current commonly used several plan production scheduling methods; Through to the semiconductor packaging enterprise actual plan production scheduling problem analysis, was proposed based on the classification of the product type optimization of tree production scheduling method; Secondly, on the basis of the combination of semiconductor packaging enterprise technological process and the characteristics of the production scheduling plan, the establishment of a centralized plan production scheduling system structure and system design; develop and implement a semiconductor encapsulation enterprise production scheduling system. To complete a business process, function structure and data flow analysis, determine the overall design of the system, set up a centralized plan production scheduling system structure and system design. Finally, develop and implement a semiconductor packaging production scheduling system of the enterprise. |
| 语种 | 中文 |
| 产权排序 | 1 |
| 页码 | 52页 |
| 源URL | [http://ir.sia.ac.cn/handle/173321/16737]  |
| 专题 | 沈阳自动化研究所_数字工厂研究室 |
| 推荐引用方式 GB/T 7714 | 王玉. 半导体封装生产线排产方法研究与实现[D]. 中国科学院沈阳自动化研究所. 中国科学院沈阳自动化研究所. 2014. |
入库方式： OAI收割
来源：沈阳自动化研究所
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