中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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  • 会议论文 [5]
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  • 2016 [5]
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Transient Electro-Thermal Coupling Analysis in Through-Silicon-Via Using Proper Orthogonal Decomposition 会议论文  OAI收割
作者:  
Lv PF(吕鹏飞);  Yan S(闫帅);  Ren ZX(任卓翔)
  |  收藏  |  浏览/下载:11/0  |  提交时间:2017/05/12
Mininature Multispectral Camera and Its Application in Machine Vision 会议论文  OAI收割
IEEE International Conference on Information and Automation, Ningbo, Zhejiang
作者:  
Cui Ma;  Hui Lin;  Guodong Zhang;  Ruxu Du
收藏  |  浏览/下载:45/0  |  提交时间:2017/01/15
Formation of Polymer Insulation Layer (Liner) on Through Silicon Vias (TSV) with High Aspect Ratio over 5:1 by Direct Spin Coating 会议论文  OAI收割
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  
Li, Liyi;  Tuan, Chia-Chi;  Moon, Kyoung-Sik;  Zhang, Guoping;  Sun, Rong
收藏  |  浏览/下载:37/0  |  提交时间:2017/01/15
The effect analysis of conic coefficient error based on data measured from Talysurf and simulation of Zernike coefficients 会议论文  OAI收割
8th international symposium on advanced optical manufacturing and testing technology (aomatt) - optical test, measurement technology, and equipment, suzhou, peoples r china, 2016-04-26
作者:  
Jiang, Kai;  Liu, Kai;  Song, Chong;  Qiu, Peng;  Wang, Peng
收藏  |  浏览/下载:12/0  |  提交时间:2016/12/02
A low-rank tensor decomposition based hyperspectral image compression algorithm 会议论文  OAI收割
17th pacific-rim conference on multimedia, pcm 2016, xi’an, china, 2016-09-15
作者:  
Zhang, Mengfei;  Du, Bo;  Zhang, Lefei;  Li, Xuelong
收藏  |  浏览/下载:21/0  |  提交时间:2017/01/11