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	Supersaturated solid-solution interfaces of Cu core/Ag shell structures and their enhanced thermal stability with high oxidation-resistant behaviors 期刊论文 OAI收割 Corrosion Science, 2022, 卷号: 201, 期号: 110269, 页码: 无作者: Wanli Li; Fengpei Lang; Cheng Liang; Ke Tong; Yang Y(杨阳) \| 收藏 \| 浏览/下载：19/0 \| 提交时间：2022/12/09
	Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics 期刊论文 OAI收割 ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 3, 页码: 3231-3240 作者: Li, Cai-Fu; Li, Wanli; Zhang, Hao; Liu, Jinting; Yang, Yang \| 收藏 \| 浏览/下载：11/0 \| 提交时间：2021/02/02 conductive pastes stretchable wirings stretchable bonding Ag microflakes recoverability
	Highly Stable Transparent Conductive Electrodes Based on Silver-Platinum Alloy-Walled Hollow Nanowires for Optoelectronic Devices 期刊论文 OAI收割 ACS APPLIED MATERIALS & INTERFACES, 2018, 卷号: 10, 期号: 42, 页码: 36128-36135 作者: Zhou, Kai Ling; Han, Chang Bao; Li, Cai Fu; Jiu, Jinting; Yang, Yang \| 收藏 \| 浏览/下载：16/0 \| 提交时间：2021/02/02 Ag Nanowires Ag@Pt alloy transparent conductive electrodes corrosion resistance flexible optoelectronic devices
	Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文 OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890 作者: Sun FuLong; Gao LiYin; Liu ZhiQuan; Zhang Hao; Sugahara Tohru \| 收藏 \| 浏览/下载：22/0 \| 提交时间：2021/02/02 NI SOLDER JOINTS NANO-SCALE TWINS INTERFACIAL RELIABILITY FE-NI COPPER METALS DEFORMATION STRENGTH DEPENDENCE BOUNDARIES Electrodeposition Nanotwinned Cu Growth mechanism Acid adsorption