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Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
机构
金属研究所 [7]
地质与地球物理研究所 [1]
合肥物质科学研究院 [1]
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OAI收割 [9]
内容类型
期刊论文 [9]
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2022 [1]
2021 [1]
2016 [1]
2015 [1]
2013 [1]
2012 [1]
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Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint
期刊论文
OAI收割
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:
Chen, Yinbo
;
Gao, Zhaoqing
;
Liu, Zhi-Quan
  |  
收藏
  |  
浏览/下载:41/0
  |  
提交时间:2022/07/01
Sn-Bi-Ag solder
Grain orientation
Temperature gradient
Aging
Ag3Sn
Influences of CO2 on the Microstructure in Sheared Olivine Aggregates
期刊论文
OAI收割
MINERALS, 2021, 卷号: 11, 期号: 5, 页码: 17
作者:
Zhang, Huihui
;
Zhao, Ningli
;
Qi, Chao
;
Huang, Xiaoge
;
Hirth, Greg
  |  
收藏
  |  
浏览/下载:46/0
  |  
提交时间:2021/10/25
olivine aggregates
CO2
crystallographic preferred orientation
AG-type fabric
Orientation and concentration of Ag conductive filament in HfO2-based resistive random access memory: first-principles study
期刊论文
OAI收割
ACTA PHYSICA SINICA, 2016, 卷号: 65, 期号: 7, 页码: 1-9
作者:
Dai Yue-Hua
;
Pan Zhi-Yong
;
Chen Zhen
;
Wang Fei-Fei
;
Li Ning
  |  
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2017/11/21
Resistive Random Access Memory
Ag Concentration
Ag Orientation
First-principles
Deformation induced alloying in crystalline - metallic glass nano-composites
期刊论文
OAI收割
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2015, 卷号: 628, 页码: 269-280
W.
;
Yao Guo, J.
;
Jagle, E. A.
;
Choi, P. P.
;
Herbig, M.
;
Schneider, J. M.
;
Raabe, D.
收藏
  |  
浏览/下载:54/0
  |  
提交时间:2015/05/08
Deformation induced alloying
Multilayers
Nanocrystalline
Metallic
glass
Shear band
Atom probe tomography
mechanical-behavior
orientation dependence
specimen preparation
single-crystals
self-diffusion
length-scale
shear bands
cu-ag
copper
multilayers
Stability of interfaces in a multilayered Ag-Cu composite during cold rolling
期刊论文
OAI收割
Scripta Materialia, 2013, 卷号: 68, 期号: 7, 页码: 542-545
Y. Z. Tian
;
Z. F. Zhang
收藏
  |  
浏览/下载:90/0
  |  
提交时间:2013/12/24
Ag-Cu composite
Twin boundary
Multilayer
Cold rolling
filamentary composites
mechanical-properties
twin boundaries
high-strength
deformation
alloys
evolution
copper
microstructures
orientation
In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction
期刊论文
OAI收割
Scripta Materialia, 2012, 卷号: 67, 期号: 3, 页码: 289-292
Q. K. Zhang
;
Z. F. Zhang
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2013/02/05
Sn-4Ag solder
In situ tensile creep
Electron backscatter diffraction
(EBSD)
Polygonization
Grains subdivision
sn-ag
stress-relaxation
fracture-behavior
thermal fatigue
deformation
grain
recrystallization
microstructure
orientation
evolution
Dislocation arrangements in cyclically deformed Au single crystal
期刊论文
OAI收割
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 23, 页码: 6244-6247
P. Li
;
S. X. Li
;
Z. G. Wang
;
Z. F. Zhang
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2012/04/13
Au single crystal
Cyclic deformation
Persistent slip bands
Dislocation arrangements
deformation-behavior
strain localization
fatigue
copper
slip
orientation
ag
Effect of orientation on cyclic stress-strain curves and dislocation patterns of Ag and Cu single crystals
期刊论文
OAI收割
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 9, 页码: 2305-2312
P. Li
;
Z. F. Zhang
;
S. X. Li
;
Z. G. Wang
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2012/04/13
Ag single crystal
Cu single crystal
Orientation
Cyclic deformation
Persistent slip bands (PSBs)
Dislocation patterns
electron channeling contrast
double slip orientation
deformation-behavior
stereographic triangle
fatigued copper
bands
side
localization
arrangements
bicrystal
Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals
期刊论文
OAI收割
Acta Materialia, 2008, 卷号: 56, 期号: 11, 页码: 2649-2662
H. F. Zou
;
H. J. Yang
;
Z. F. Zhang
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2012/04/13
Cu single crystal
orientation
intermetallic compounds (IMCs)
coarsening mechanism
growth kinetics
lead-free solders
interfacial reactions
eutectic snpb
joints
microstructure
sn-3.5ag
sn-0.7cu
copper