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浏览/检索结果: 共4条，第1-4条 帮助

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Chiplever: A Hardware-Software Co-Design Framework Toward Extension of Chiplet System for Fully Homomorphic Encryption 期刊论文  OAI收割
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2026, 卷号: 45, 期号: 2, 页码: 603-616
作者:  Du, Yibo;  Wang, Ying;  Wang, Mengdi;  Li, Xiaowei;  Han, Yinhe
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Resister: A Resilient Interposer Architecture for Chiplet to Mitigate Timing Side-Channel Attacks 期刊论文  OAI收割
ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS, 2025, 卷号: 30, 期号: 5, 页码: 23
作者:  Wang, Xinrui;  Feng, Lang;  Wang, Yujie;  Xu, Taotao;  Han, Yinhe
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FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer 期刊论文  OAI收割
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2024, 页码: 13
作者:  Jiao, Bo;  Xu, Lei;  Yu, Xinyu;  Yang, Haitao;  Zhu, Haozhe
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Chiplet技术发展现状 期刊论文  OAI收割
科技导报, 2023, 卷号: 41, 期号: 19, 页码: 113
作者:  项少林;  郭茂;  蒲菠;  方刘禄;  刘淑娟
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