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Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
机构
力学研究所 [2]
长春光学精密机械与物... [2]
广州能源研究所 [2]
西安光学精密机械研究... [1]
工程热物理研究所 [1]
采集方式
OAI收割 [8]
内容类型
期刊论文 [5]
会议论文 [3]
发表日期
2022 [1]
2017 [1]
2016 [2]
2013 [1]
2011 [1]
2010 [1]
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学科主题
Thermodyna... [1]
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Research on selection of high intensity laser beam expanding system
会议论文
OAI收割
Kunming, China, 2021-12-07
作者:
Gao, Na
;
Zhang, XiangHui
;
Liu, Jie
;
Shen, ZeYi
;
Xin, Wei
  |  
收藏
  |  
浏览/下载:50/0
  |  
提交时间:2022/04/27
beam expander
reflecting system
refraction system
off-axis,coaxial
采用涡轮膨胀机的有机朗肯循环系统优化
期刊论文
OAI收割
新能源进展, 2017, 卷号: 5, 期号: 1, 页码: 23-31
作者:
刘茜
;
刘莉娜
;
王令宝
;
卜宪标
;
李华山
  |  
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2018/12/21
R245fa
低温余热
有机朗肯循环
涡轮膨胀机
参数优化
敏感性分析
R245fa
low-temperature waste heat
organic Rankine cycle
turbo-expander
parameter optimization
sensitivity analysis
Study of a single-valve reciprocating expander
期刊论文
OAI收割
JOURNAL OF THE ENERGY INSTITUTE, 2016, 卷号: 89, 期号: 3, 页码: 400-413
作者:
Zhang, Xinjing
;
Xu, Yujie
;
Xu, Jian
;
Xue, Haobai
;
Chen, Haisheng
收藏
  |  
浏览/下载:39/0
  |  
提交时间:2016/10/14
CAES
Expander
Simulation
Flow losses
Vortex
Experimental investigation on the CO2 transcritical power cycle
期刊论文
OAI收割
ENERGY, 2016, 卷号: 95, 页码: 247-254
作者:
Pan LS(潘利生)
;
Li B(李博)
;
Wei XL(魏小林)
;
Li T(李腾)
;
Pan, LS
收藏
  |  
浏览/下载:38/0
  |  
提交时间:2016/03/21
CO2 transcritical power cycle
Rolling piston expander
System performance
Experimental study
Performance analysis and working fluid selection for geothermal energy-powered organic Rankine-vapor compression air conditioning
期刊论文
OAI收割
Geothermal Energy, 2013, 卷号: 1, 期号: 1
作者:
Bu,Xianbiao
;
Wang,Lingbao
;
Li,Huashan
  |  
收藏
  |  
浏览/下载:135/0
  |  
提交时间:2019/09/12
Working fluid selection
Waste heat
Air conditioning
Hot spring
Organic Rankine-vapor compression
Expander
Study of working fluid selection of organic Rankine cycle (ORC) for engine waste heat recovery
期刊论文
OAI收割
Energy, 2011, 卷号: 36, 期号: 5, 页码: 3406-3418
作者:
Wang EH
;
Zhang HG
;
Fan BY
;
Ouyang MG
;
Zhao Y(赵颖)
收藏
  |  
浏览/下载:57/0
  |  
提交时间:2012/03/31
Organic Rankine Cycle
Waste Heat Recovery
Working Fluid
Engine
Matlab
Performance Analysis
Dry Fluids
Power
Optimization
Expander
Design
System
Far-field focusing of laser beam based on digital image processing techniques (EI CONFERENCE)
会议论文
OAI收割
Optoelectronic Imaging and Multimedia Technology, October 18, 2010 - October 20, 2010, Beijing, China
作者:
Zhao S.
;
Tian Y.-Z.
;
Liu L.-S.
;
Guo J.
;
Zhang H.-Y.
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2013/03/25
In order to lead the laser beam transmit in the atmosphere convergently
an experiment of laser focus at the distance of 450m and 300m has been operated in the outdoor place. The actual manipulations are as follows: Firstly
the laser was collimated by a beam expander
then the near-parallel laser beam was transmitted with a Galileo telescope system
and the distance between the concave lens and the convex lens can be tuned through a precise displacement platform
so the focus of the system changed due to the tiny displacement of the concave lens. Secondly
the average power of the laser spot can be measured using power meter
the power is 47.67mW and the standard deviation is 0.67mW while the focal length is 450m. Thirdly
the energy distribution was found through the laser beam analyzer. The spot images were saved using the beam analyzer
then the saved image can be processed with Matlab software afterwards. The function named EDGE and Sobel operator was used in the pre-processing of the saved image
then method of median filter was used in the course of image de-noising and 53H filter was adopted in the signal analysis. The diameter of laser spot was obtained by the method above
the diameter is 5.56mm and the standard deviation is 0.24mm. The spot center excursion is 0.56mm
it is 10.43% of the total diameter of the laser spot. At last
the key factors of the energy dissipation in the focusing system can be summarized as follows: restriction of the diffraction limit
attenuation in the atmosphere
geometrical aberration of optical system
and the diffraction limit and the geometrical aberration are significant in the three factors above
so we can reduce the impact of the both factors during the design of optical system. The reliable referenced data of the system design can be acquired through the primary experiment research. 2010 SPIE.
Study on LD-pumped Nd:YAG laser cutter (EI CONFERENCE)
会议论文
OAI收割
ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China
作者:
Zhang G.
;
Zhang G.
;
Zhang G.
;
Zhang J.
;
Zhang J.
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2013/03/25
The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting
when the cutting velocity equals 100mm/min
while it is also unperfected with ecumenical laser cutter without good beam quality or precise laseroptics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laseroptics system are pivotal to obtain excellent cutting effect such as thick groove depth
double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow
rapid cutting speed
the cutting quality meets the expecting demand.
fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power
using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence
a /4 waveplate to compensate heat -induced birefraction
utilize the Nd:YAG self- aperture effect
more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M2) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens
double axis linear step motor positioning system
suitable beam expander multiplying factor
appropriate diameter of exit beam aperture
proper repetition rate
when the cutting velocity equals 400mm/min
0.75mm thick silicon wafer can be penetrated